Zhiyi Guo , Tengfei Li , Hao Zhou , Changwei Tan , Ximei Wang , Shuhong Nie , Wenya Xu , Fangfang Pei , Xiuqing Meng , Xinzhou Wu , Xiaolian Chen , Wenming Su , Kai Zhao , Changqing Ye
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引用次数: 0
Abstract
Flexible electrochromic devices (FECDs) and electrochromic fabrics (ECFs) have attracted great attention in fashion clothing decoration and camouflage due to their low energy consumption and bi-stability. However, the complex and hierarchical structures of fabric substrates pose formidable challenges to the excellent and stable conductivity of ECFs. Here, we developed novel ECFs with excellent EC properties and outstanding stability by integrating FECDs with polyester fabric. Firstly, highly conductive silver (Ag)/nickel (Ni) mesh was heat-laminated on the thermoplastic polyurethane (TPU) film, serving as flexible electrode with high transmittance. On this basis, the FECDs exhibit an exceptionally high transmittance (46.4 %), rapid response time (bleaching for 0.5 s at 0.8 V and coloring for 0.9 s at −0.4 V), outstanding stability (2.6 % decreased after 5000 cyclic switching), and low-power consumption (<0.05 J per cycle in 60 cm2 FECDs). By harnessing the thermoplastic property of TPU, the FECDs can be readily transferred to fabric for the realization of ECFs, without compromising their comprehensive performances. More importantly, the outstanding conductivity and mechanical stability of ECFs under various challenging conditions (mechanical bending, physical damage, etc.) are unparalleled. We believe the simple-structured high-performance ECFs would be promising for flexible smart textile in any textile-based markets, such as wearable and intelligence camouflage.
期刊介绍:
Sustainable Materials and Technologies (SM&T), an international, cross-disciplinary, fully open access journal published by Elsevier, focuses on original full-length research articles and reviews. It covers applied or fundamental science of nano-, micro-, meso-, and macro-scale aspects of materials and technologies for sustainable development. SM&T gives special attention to contributions that bridge the knowledge gap between materials and system designs.