Optimization of Process Parameters to Minimize Porosity and Splash in Cold Metal Transfer and Pulse Wire Arc Additive Manufacturing of High-Strength Aluminum Alloy

IF 3.4 3区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Zhiqiang Zhang, Shuai Zhuo, Xuecheng Lu, Junpei Yan, Pan Gong, Tiangang Zhang, Dongquan Wu, Hongli Liu
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Abstract

This article examines the application of advanced cold metal transfer plus pulse composite arc technology for the thin-walled additive manufacturing of high-strength aluminum alloy AA2024. Response surface methodology is employed to design experiments and variance analysis is utilized to assess the model's reliability. Results are further optimized and validated using the non-dominated sorting genetic algorithm II. The focus is on optimizing key process parameters—wire feeding speed, interlayer temperature, protective gas flow rate, and welding wire elongation—to minimize porosity and splash. A comprehensive analysis of parameter interactions is conducted using contour maps and response surface plots. The findings indicate that wire elongation most significantly affects porosity, while wire feeding speed has the greatest impact on splash. The optimized parameters effectively reduce grain size under low heat input conditions, decrease hydrogen-induced porosity and solidification defects, achieving a porosity rate of 0.46% and a splash rate of 0.83%.

Abstract Image

高强铝合金冷金属转移和脉冲电弧增材制造工艺参数优化以减少气孔和飞溅
研究了先进冷金属转移+脉冲复合电弧技术在高强度铝合金AA2024薄壁增材制造中的应用。实验设计采用响应面法,模型可靠性评估采用方差分析。利用非支配排序遗传算法II对结果进行进一步优化和验证。重点是优化关键工艺参数——送丝速度、层间温度、保护气体流速和焊丝伸长——以最大限度地减少气孔和飞溅。利用等高线图和响应面图进行了参数相互作用的综合分析。结果表明,线材伸长率对气孔率的影响最为显著,而送丝速度对飞溅的影响最大。优化后的参数在低热输入条件下有效减小了晶粒尺寸,降低了氢致气孔率和凝固缺陷,气孔率为0.46%,飞溅率为0.83%。
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来源期刊
Advanced Engineering Materials
Advanced Engineering Materials 工程技术-材料科学:综合
CiteScore
5.70
自引率
5.60%
发文量
544
审稿时长
1.7 months
期刊介绍: Advanced Engineering Materials is the membership journal of three leading European Materials Societies - German Materials Society/DGM, - French Materials Society/SF2M, - Swiss Materials Federation/SVMT.
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