{"title":"A Compact Dual-Mode Dual-Band CMOS Power Amplifier Covering 5G FR1 and FR2","authors":"Jingye Zhang;Jiawen Chen;Taotao Xu;Pei Qin;Xiang Yi;Liang Wu;Haoshen Zhu;Wenquan Che;Quan Xue","doi":"10.1109/TMTT.2025.3543447","DOIUrl":null,"url":null,"abstract":"This article presents a dual-mode, dual-band power amplifier (PA) capable of covering both the fifth-generation (5G) FR1 and FR2 bands for 5G user equipment driver applications. The common-mode (CM) path, often overlooked in a typical differential-mode (DM) CMOS PA, is analyzed and utilized as an alternative path to cover a second frequency band. A universal topology is proposed for the utilization of both DM and CM in PA and other RF circuits. By assigning the millimeter-wave (mm-Wave) and sub-7 GHz bands to DM and CM paths, respectively, this PA achieves coverage of both 3.5 and 27 GHz bands with only one amplifying stage and consequently a compact layout. On the DM path, the proposed PA achieves a <inline-formula> <tex-math>${P}_{1{\\text{dB}}}$ </tex-math></inline-formula> and <inline-formula> <tex-math>${\\mathrm {PAE}}_{1{\\text {dB}}}$ </tex-math></inline-formula> of 18.1 dBm and 32.4% at 24 GHz, while on the CM path, the corresponding performance is 15.3 dBm and 35.5% at 3.7 GHz. The proposed PA exhibits an adjacent channel leakage ratio (ACLR) of −25.9 dBc, an average power-added efficiency (PAE) of 17%, and an average output power of 12.4 dBm at −24.7 dB EVMRMS with a 64 QAM 200 MSym/s modulation signal at 26 GHz in DM. Similarly, with 256 QAM 50 MSym/s modulation at 3.6 GHz in CM, the PA demonstrates −35.6 dBc ACLR, 22.5% average PAE, and 10.7 dBm average power at −31.1 dB EVMRMS. Furthermore, measurements with two carriers at 24 and 3.7 GHz indicate that the PA has the potential for concurrent operation in both modes. The PA is fabricated in a 65 nm CMOS process with a core area of 0.32 mm2.","PeriodicalId":13272,"journal":{"name":"IEEE Transactions on Microwave Theory and Techniques","volume":"73 4","pages":"1985-1999"},"PeriodicalIF":4.1000,"publicationDate":"2025-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Microwave Theory and Techniques","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10907266/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article presents a dual-mode, dual-band power amplifier (PA) capable of covering both the fifth-generation (5G) FR1 and FR2 bands for 5G user equipment driver applications. The common-mode (CM) path, often overlooked in a typical differential-mode (DM) CMOS PA, is analyzed and utilized as an alternative path to cover a second frequency band. A universal topology is proposed for the utilization of both DM and CM in PA and other RF circuits. By assigning the millimeter-wave (mm-Wave) and sub-7 GHz bands to DM and CM paths, respectively, this PA achieves coverage of both 3.5 and 27 GHz bands with only one amplifying stage and consequently a compact layout. On the DM path, the proposed PA achieves a ${P}_{1{\text{dB}}}$ and ${\mathrm {PAE}}_{1{\text {dB}}}$ of 18.1 dBm and 32.4% at 24 GHz, while on the CM path, the corresponding performance is 15.3 dBm and 35.5% at 3.7 GHz. The proposed PA exhibits an adjacent channel leakage ratio (ACLR) of −25.9 dBc, an average power-added efficiency (PAE) of 17%, and an average output power of 12.4 dBm at −24.7 dB EVMRMS with a 64 QAM 200 MSym/s modulation signal at 26 GHz in DM. Similarly, with 256 QAM 50 MSym/s modulation at 3.6 GHz in CM, the PA demonstrates −35.6 dBc ACLR, 22.5% average PAE, and 10.7 dBm average power at −31.1 dB EVMRMS. Furthermore, measurements with two carriers at 24 and 3.7 GHz indicate that the PA has the potential for concurrent operation in both modes. The PA is fabricated in a 65 nm CMOS process with a core area of 0.32 mm2.
期刊介绍:
The IEEE Transactions on Microwave Theory and Techniques focuses on that part of engineering and theory associated with microwave/millimeter-wave components, devices, circuits, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals. This includes scientific, technical, and industrial, activities. Microwave theory and techniques relates to electromagnetic waves usually in the frequency region between a few MHz and a THz; other spectral regions and wave types are included within the scope of the Society whenever basic microwave theory and techniques can yield useful results. Generally, this occurs in the theory of wave propagation in structures with dimensions comparable to a wavelength, and in the related techniques for analysis and design.