S. Kanazawa;N. Watanabe;M. Chen;T. Shindo;W. Kobayashi;Y. Nakanishi;M. Usui;K. Hadama;H. Nakamura
{"title":"226.875-Gbit/s 4-PAM Operation of High-Output Power AXEL Chip on Carrier (CoC)","authors":"S. Kanazawa;N. Watanabe;M. Chen;T. Shindo;W. Kobayashi;Y. Nakanishi;M. Usui;K. Hadama;H. Nakamura","doi":"10.1109/LPT.2025.3552120","DOIUrl":null,"url":null,"abstract":"In this work, we propose a wire interconnection AXEL CoC designed to increase the modulation bandwidth for 200-Gbit/s/<inline-formula> <tex-math>$\\lambda $ </tex-math></inline-formula> operation and simplify the CoC fabrication process. We first developed an electro-absorption modulator (EAM) that maintains a balance between the extinction ratio and the modulation bandwidth, and then, to increase the modulation bandwidth, we designed a termination circuit that can be integrated with the EAM and the CoC to reduce the bonding wire length. We obtained simulated 3-dB bandwidths of over 80 GHz and over 98 GHz with the longest and shortest bonding wire lengths, respectively. The 3-dB bandwidth of the AXEL CoC was over 95 GHz, which is enough for 226-Gbit/s/<inline-formula> <tex-math>$\\lambda $ </tex-math></inline-formula> operation. Moreover, under 226.875 Gbit/s 4-PAM operation, the average output power exceeded +9.0 dBm thanks to the integrated SOA in the chip.","PeriodicalId":13065,"journal":{"name":"IEEE Photonics Technology Letters","volume":"37 8","pages":"481-484"},"PeriodicalIF":2.3000,"publicationDate":"2025-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Photonics Technology Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10930517/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, we propose a wire interconnection AXEL CoC designed to increase the modulation bandwidth for 200-Gbit/s/$\lambda $ operation and simplify the CoC fabrication process. We first developed an electro-absorption modulator (EAM) that maintains a balance between the extinction ratio and the modulation bandwidth, and then, to increase the modulation bandwidth, we designed a termination circuit that can be integrated with the EAM and the CoC to reduce the bonding wire length. We obtained simulated 3-dB bandwidths of over 80 GHz and over 98 GHz with the longest and shortest bonding wire lengths, respectively. The 3-dB bandwidth of the AXEL CoC was over 95 GHz, which is enough for 226-Gbit/s/$\lambda $ operation. Moreover, under 226.875 Gbit/s 4-PAM operation, the average output power exceeded +9.0 dBm thanks to the integrated SOA in the chip.
期刊介绍:
IEEE Photonics Technology Letters addresses all aspects of the IEEE Photonics Society Constitutional Field of Interest with emphasis on photonic/lightwave components and applications, laser physics and systems and laser/electro-optics technology. Examples of subject areas for the above areas of concentration are integrated optic and optoelectronic devices, high-power laser arrays (e.g. diode, CO2), free electron lasers, solid, state lasers, laser materials'' interactions and femtosecond laser techniques. The letters journal publishes engineering, applied physics and physics oriented papers. Emphasis is on rapid publication of timely manuscripts. A goal is to provide a focal point of quality engineering-oriented papers in the electro-optics field not found in other rapid-publication journals.