{"title":"Turnover Temperature Point Adjustment in Mechanically Coupled Single-Crystal Silicon MEMS Resonators","authors":"Yuhao Xiao;Jinzhao Han;Bowen Li;Guoqiang Wu","doi":"10.1109/JMEMS.2024.3524384","DOIUrl":null,"url":null,"abstract":"This paper presents an effective approach for adjusting the zero temperature coefficient of frequency (turnover point) in mechanically coupled single-crystal silicon (SCS) microelectromechanical system (MEMS) resonators. The mechanically coupled MEMS resonators are fabricated on a heavily n-type doped SCS with a phosphorus doping concentration of around <inline-formula> <tex-math>$1.0\\times 10^{20}$ </tex-math></inline-formula> cm<inline-formula> <tex-math>$^ - 3 $ </tex-math></inline-formula> for achieving high turnover points. A turnover point tuning prediction model is derived, showing that the turnover point of mechanically coupled resonators can be represented as the weighted average sum of the product of the effective mass and the second order TCF of each individual resonator, along with its corresponding turnover point. By leveraging mechanical coupling between breathing-ring (BR) mode resonators and length-extensional (LE) or width-extensional (WE) mode resonators, the turnover point of mechanically coupled resonator can be purposely manipulated to above industrial temperature ranges by adjusting the dimensions of the coupled components. Such turnover temperatures can be employed in micro-oven-controlled MEMS oscillators (OCMOs) to achieve excellent frequency stability. The results offer valuable insights into optimizing the frequency-temperature characteristic of MEMS resonators in high-end timing field.[2024-0184]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 2","pages":"134-143"},"PeriodicalIF":2.5000,"publicationDate":"2025-01-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10839227/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents an effective approach for adjusting the zero temperature coefficient of frequency (turnover point) in mechanically coupled single-crystal silicon (SCS) microelectromechanical system (MEMS) resonators. The mechanically coupled MEMS resonators are fabricated on a heavily n-type doped SCS with a phosphorus doping concentration of around $1.0\times 10^{20}$ cm$^ - 3 $ for achieving high turnover points. A turnover point tuning prediction model is derived, showing that the turnover point of mechanically coupled resonators can be represented as the weighted average sum of the product of the effective mass and the second order TCF of each individual resonator, along with its corresponding turnover point. By leveraging mechanical coupling between breathing-ring (BR) mode resonators and length-extensional (LE) or width-extensional (WE) mode resonators, the turnover point of mechanically coupled resonator can be purposely manipulated to above industrial temperature ranges by adjusting the dimensions of the coupled components. Such turnover temperatures can be employed in micro-oven-controlled MEMS oscillators (OCMOs) to achieve excellent frequency stability. The results offer valuable insights into optimizing the frequency-temperature characteristic of MEMS resonators in high-end timing field.[2024-0184]
期刊介绍:
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.