Yun Geng , Xiaofei Yao , Minju Xu , Chen Guan , Lianke Wang , Yingsan Geng , Zhiyuan Liu
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引用次数: 0
Abstract
In double-break vacuum circuit breakers (VCBs) during capacitor bank switching, uneven voltage distribution across the vacuum gaps is one of the key issues under investigation. Most existing research focuses on the interruption process, and there is a lack of studies examining the impact of voltage equalization capacitors on the pre-strike characteristics of double-break VCBs. This paper primarily conducts experimental research and comparative analysis on the impact of different equalization methods on the pre-strike characteristics of double-break VCBs under direct current (DC) voltage during closing operations. The experiments involve comparing the pre-strike characteristics of double-break VCBs without grading capacitors to those with grading capacitors. Key measurements include determining the pre-strike gap of high-voltage and low-voltage vacuum interrupters (VIs) in double-break VCBs at different levels of DC voltage, as well as analyzing the floating voltage during pre-strike. Additionally, cumulative probability distribution analysis is performed for pre-strike events. The 50 % pre-strike gap (d50), dispersion in pre-strike gap (σpre), and floating voltage during pre-strike are compared and analyzed for both high-voltage and low-voltage VIs in each experimental group. Furthermore, this study discusses the underlying causes behind these results.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.