Adhesion of 2D Materials: Measurement and Modulation

Abstract

Two-dimensional (2D) materials are promising for next-generation electronic devices and systems due to their unique physical properties. The interfacial adhesion plays a vital role not only in the synthesis, transfer and manipulation of 2D materials but also in the manufacture, integration and performance of the functional devices. However, the atomic thickness and limited lateral dimensions of 2D materials make the accurate measurement and modulation of their interfacial adhesion energy challenging. In this review, the recent advances in the measurement and modulation of the interfacial adhesion properties of 2D materials are systematically combed. Experimental methods and relative theoretical models for the adhesion measurement of 2D materials are summarized, with their scope of application and limitations discussed. The measured adhesion energies between 2D materials and various substrates are described in categories, where the typical adhesion modulation strategies of 2D materials are also introduced. Finally, the remaining challenges and opportunities for the interfacial adhesion measurement and modulation of 2D materials are presented. This paper provides guidance for addressing the adhesion issues in devices and systems involving 2D materials.