Measuring Mechanical Parameters of 2D Materials Based on the Bulge Test

Abstract

The bulge test is a widely utilized method for assessing the mechanical properties of thin films, including metals, polymers, and semiconductors. However, as film thickness diminishes to nanometer scales, boundary conditions dominated by weak van der Waals forces significantly impact mechanical responses. Instead of sample fracture, interfacial shear deformation and delamination become the primary deformation modes, thereby challenging the applicability of conventional bulge models. To accommodate the interfacial effect, a modified mechanical model based on the bulge test has been proposed. This review summarizes recent advancements in the bulge test to highlight the potential challenges and opportunities for future research.