High Thermal Conductivity in Nano/Micro-Biphasic Liquid Metal/Carbon Nanofiber/Diamond Composite

IF 9.6 1区化学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

ACS Materials Letters Pub Date : 2025-03-25 DOI:10.1021/acsmaterialslett.4c0244910.1021/acsmaterialslett.4c02449

Chengzong Zeng*, Shiyueyan Lan, Mengyi Yang, Guangyin Liu, Qin Tang and Jun Shen,

{"title":"High Thermal Conductivity in Nano/Micro-Biphasic Liquid Metal/Carbon Nanofiber/Diamond Composite","authors":"Chengzong Zeng*, Shiyueyan Lan, Mengyi Yang, Guangyin Liu, Qin Tang and Jun Shen, ","doi":"10.1021/acsmaterialslett.4c0244910.1021/acsmaterialslett.4c02449","DOIUrl":null,"url":null,"abstract":"Ga-based liquid metal (LM) composites incorporated with nanofillers hold substantial promise for application in the micro/submicron scale thermal management of electronic devices. However, the uniform compounding of LM with carbon nanofibers (CNFs) without phase separation is challenging. Herein, ultrasonic dispersion and in situ surface modification (phenolic resin, PR) were conducted to obtain a eutectic Ga–In (EGaIn)/CNF@PR compound. To further improve the low out-of-plane thermal conductivity of EGaIn/CNF, 27 wt % diamond microparticles were compounded with EGaIn/CNF containing 0.027 wt % CNF. A high thermal conductivity of 100 W m–1 K–1 was obtained, which was 384% higher than that of EGaIn. Combining the interfacial adsorption energy analysis, the bonding microstructure in the composite was CNF(/diamond)@PR@(Ga,In)2O3/EGaIn. Additionally, the composite exhibited excellent thermal performance as a thermal interface material in practical CPU tests. This indicates that combined use of micro and nano fillers can remarkably augment LM’s thermal conductivity at a relatively low filler content.","PeriodicalId":19,"journal":{"name":"ACS Materials Letters","volume":"7 4","pages":"1555–1562 1555–1562"},"PeriodicalIF":9.6000,"publicationDate":"2025-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Materials Letters","FirstCategoryId":"92","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acsmaterialslett.4c02449","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

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Abstract

Ga-based liquid metal (LM) composites incorporated with nanofillers hold substantial promise for application in the micro/submicron scale thermal management of electronic devices. However, the uniform compounding of LM with carbon nanofibers (CNFs) without phase separation is challenging. Herein, ultrasonic dispersion and in situ surface modification (phenolic resin, PR) were conducted to obtain a eutectic Ga–In (EGaIn)/CNF@PR compound. To further improve the low out-of-plane thermal conductivity of EGaIn/CNF, 27 wt % diamond microparticles were compounded with EGaIn/CNF containing 0.027 wt % CNF. A high thermal conductivity of 100 W m^–1 K^–1 was obtained, which was 384% higher than that of EGaIn. Combining the interfacial adsorption energy analysis, the bonding microstructure in the composite was CNF(/diamond)@PR@(Ga,In)₂O₃/EGaIn. Additionally, the composite exhibited excellent thermal performance as a thermal interface material in practical CPU tests. This indicates that combined use of micro and nano fillers can remarkably augment LM’s thermal conductivity at a relatively low filler content.

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纳米/微双相液态金属/碳纳米纤维/金刚石复合材料的高导热性

结合纳米填料的镓基液态金属（LM）复合材料在电子器件的微/亚微米级热管理方面具有巨大的应用前景。然而，无相分离的LM与碳纳米纤维（CNFs）的均匀复合是一个挑战。本文采用超声分散和原位表面改性（酚醛树脂，PR）法制备了Ga-In (EGaIn)/CNF@PR共晶化合物。为了进一步提高EGaIn/CNF的低面外导热系数，将27 wt %的金刚石微粒与含有0.027 wt % CNF的EGaIn/CNF复合。获得了100 W m-1 K-1的高导热系数，比EGaIn高384%。结合界面吸附能分析，复合材料中的键合微观结构为CNF(/diamond)@PR@(Ga, in)2O3/EGaIn。此外，在实际CPU测试中，该复合材料作为热界面材料表现出优异的热性能。这表明，在填料含量相对较低的情况下，微纳米填料的联合使用可以显著提高LM的导热系数。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

ACS Materials Letters MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

14.60

自引率

3.50%

发文量

261

期刊介绍： ACS Materials Letters is a journal that publishes high-quality and urgent papers at the forefront of fundamental and applied research in the field of materials science. It aims to bridge the gap between materials and other disciplines such as chemistry, engineering, and biology. The journal encourages multidisciplinary and innovative research that addresses global challenges. Papers submitted to ACS Materials Letters should clearly demonstrate the need for rapid disclosure of key results. The journal is interested in various areas including the design, synthesis, characterization, and evaluation of emerging materials, understanding the relationships between structure, property, and performance, as well as developing materials for applications in energy, environment, biomedical, electronics, and catalysis. The journal has a 2-year impact factor of 11.4 and is dedicated to publishing transformative materials research with fast processing times. The editors and staff of ACS Materials Letters actively participate in major scientific conferences and engage closely with readers and authors. The journal also maintains an active presence on social media to provide authors with greater visibility.