Feihu Song , Xinyu Xia , Pingyue Gu , Xiaodong Shen , Li Liu , Chonggao Sun
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引用次数: 0
Abstract
Anemorumbograph has been widely utilized in aerospace, aviation, and meteorological monitoring. To achieve the portability and the miniaturization, the design of an anemorumbograph was presented in this research, which was based on fluid dynamics simulation and experimental validation. Firstly, the temperature fields on a plane under different flow conditions were analyzed with FLUENT. Therefore eight NTC thermistors around the central resistance wire were arranged on the sensor surface. Secondly, the responses of the eight NTC thermistors under the winds with various speeds and directions were recorded. Also the effect of the environmental temperature on the thermistors response was illustrated. Then an algorithm based on third-order Fourier series fitting and environmental temperature correction was proposed. Experimental validation with a manufactured sensor PCB with a size of 20 mm in diameter and a power consumption of 0.635 W. Anemorumbograph based on thermal field distribution was also performed through wind tunnel tests. The results demonstrated that the detection range of wind speed was 1–30 m/s ± (0.5 +0.03 v) m/s, and the detection range of wind direction was 0–360° with an accuracy of ± 5°. The sensor has good linearity within ambient temperature range of −10–40 ℃.
期刊介绍:
Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:
• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.
• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Etc...