{"title":"Properties comparison of dielectric ceramic parts manufactured by powder pressing and injection molding","authors":"Z. Chen, T. Li, S. L. Liew, S. Wang, L. Chen","doi":"10.1111/ijac.15007","DOIUrl":null,"url":null,"abstract":"<p>Dual-phase dielectric ceramic samples of Mg<sub>2</sub>SiO<sub>4</sub>/Ba(AlSiO<sub>4</sub>)<sub>2</sub> were fabricated by ceramic injection molding (CIM), and they were systematically compared with the ones fabricated by conventional powder pressing (CP). It was found that by tuning the processing parameters, CIM samples with density, microstructure, grain size, and phase composition comparable with the CP counterparts can be produced. With optimized processing parameters, CIM samples with a relative density of 94.2% were accomplished, along with homogeneous phase distribution and uniform grain size. Meanwhile, satisfactory dielectric properties were also achieved (a dielectric constant of 6.67, a temperature coefficient of −0.94 ppm/°C, and a quality factor of 352,000 GHz). Moreover, a demonstrator with various blind holes and slots was fabricated by the CIM method, which exhibited good geometrical integrity, uniform microstructure, and consistent mechanical properties.</p>","PeriodicalId":13903,"journal":{"name":"International Journal of Applied Ceramic Technology","volume":"22 3","pages":""},"PeriodicalIF":1.8000,"publicationDate":"2024-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Applied Ceramic Technology","FirstCategoryId":"88","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1111/ijac.15007","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
Dual-phase dielectric ceramic samples of Mg2SiO4/Ba(AlSiO4)2 were fabricated by ceramic injection molding (CIM), and they were systematically compared with the ones fabricated by conventional powder pressing (CP). It was found that by tuning the processing parameters, CIM samples with density, microstructure, grain size, and phase composition comparable with the CP counterparts can be produced. With optimized processing parameters, CIM samples with a relative density of 94.2% were accomplished, along with homogeneous phase distribution and uniform grain size. Meanwhile, satisfactory dielectric properties were also achieved (a dielectric constant of 6.67, a temperature coefficient of −0.94 ppm/°C, and a quality factor of 352,000 GHz). Moreover, a demonstrator with various blind holes and slots was fabricated by the CIM method, which exhibited good geometrical integrity, uniform microstructure, and consistent mechanical properties.
期刊介绍:
The International Journal of Applied Ceramic Technology publishes cutting edge applied research and development work focused on commercialization of engineered ceramics, products and processes. The publication also explores the barriers to commercialization, design and testing, environmental health issues, international standardization activities, databases, and cost models. Designed to get high quality information to end-users quickly, the peer process is led by an editorial board of experts from industry, government, and universities. Each issue focuses on a high-interest, high-impact topic plus includes a range of papers detailing applications of ceramics. Papers on all aspects of applied ceramics are welcome including those in the following areas:
Nanotechnology applications;
Ceramic Armor;
Ceramic and Technology for Energy Applications (e.g., Fuel Cells, Batteries, Solar, Thermoelectric, and HT Superconductors);
Ceramic Matrix Composites;
Functional Materials;
Thermal and Environmental Barrier Coatings;
Bioceramic Applications;
Green Manufacturing;
Ceramic Processing;
Glass Technology;
Fiber optics;
Ceramics in Environmental Applications;
Ceramics in Electronic, Photonic and Magnetic Applications;