Yi Pu, Debin Lin, Daokuan Liang, Yongbao Feng, Peng Xu, Qiulong Li
{"title":"Investigating the sintering temperature and slurry tape formulation to prepare doped BaTi4O9 ceramic substrates with good dielectric properties","authors":"Yi Pu, Debin Lin, Daokuan Liang, Yongbao Feng, Peng Xu, Qiulong Li","doi":"10.1007/s10854-025-14650-0","DOIUrl":null,"url":null,"abstract":"<div><p>In microwave electronic applications, the advancement of resonators, filters, substrates, and waveguide circuits is significantly influenced by the dielectric ceramics. This research focuses on preparing Nb-doped BaTi<sub>4</sub>O<sub>9</sub> (BT-N) dielectric ceramics, with a specific emphasis on the dielectric and mechanical properties of the BT-N tape-cast substrates. Herein, we adopted conventional solid-state sintering techniques to fabricate the BT-N ceramics and optimized the tape casting process. The slip composition was meticulously adjusted to ensure the green tapes with a smooth surface finish and robust mechanical properties, which shows high tensile strength of 0.81 MPa. The investigation results demonstrate that excessive sintering temperatures or soaking times lead to the emergence of the Ba<sub>2</sub>Ti<sub>9</sub>O<sub>20</sub> secondary phase, thereby adversely impacting the material’s properties. The sintering kinetics of the BT-N substrates result demonstrates that the sintering temperature of 1260 °C for a duration of 2.5 h resulted in the most favorable combination of high density and superior dielectric characteristics. The sample using tape casting lamination process exhibits a high bulk density of 4.52 g/cm<sup>3</sup>, accompanied by a dielectric constant (ε<sub>r</sub>) of 40.38 and dielectric loss (tanδ) of 8.99 × 10<sup>–4</sup>. Under the tape casting processing, the dielectric properties of the BT-N ceramic substrates are significantly optimized.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 10","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14650-0","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In microwave electronic applications, the advancement of resonators, filters, substrates, and waveguide circuits is significantly influenced by the dielectric ceramics. This research focuses on preparing Nb-doped BaTi4O9 (BT-N) dielectric ceramics, with a specific emphasis on the dielectric and mechanical properties of the BT-N tape-cast substrates. Herein, we adopted conventional solid-state sintering techniques to fabricate the BT-N ceramics and optimized the tape casting process. The slip composition was meticulously adjusted to ensure the green tapes with a smooth surface finish and robust mechanical properties, which shows high tensile strength of 0.81 MPa. The investigation results demonstrate that excessive sintering temperatures or soaking times lead to the emergence of the Ba2Ti9O20 secondary phase, thereby adversely impacting the material’s properties. The sintering kinetics of the BT-N substrates result demonstrates that the sintering temperature of 1260 °C for a duration of 2.5 h resulted in the most favorable combination of high density and superior dielectric characteristics. The sample using tape casting lamination process exhibits a high bulk density of 4.52 g/cm3, accompanied by a dielectric constant (εr) of 40.38 and dielectric loss (tanδ) of 8.99 × 10–4. Under the tape casting processing, the dielectric properties of the BT-N ceramic substrates are significantly optimized.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.