Effect of a novel alginate/5-aminovaleric acid slurry with CeO2/MoS2 abrasives on surface roughness and material removal rate of quartz glass

IF 6.3 2区材料科学 Q2 CHEMISTRY, PHYSICAL

Applied Surface Science Pub Date : 2025-03-31 DOI:10.1016/j.apsusc.2025.163096

Gong Lv , Enqiang Hao , Zefang Zhang , Shengsheng Liu , Yuxi Cao , Tong Liu , Xufeng Li , Kaiyue Wang

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引用次数: 0

Abstract

Chemical mechanical polishing (CMP) technology is an effective method for improving the surface planarization of quartz glass. However, the high cost of abrasive modification and the presence of toxic chemical components in the reagents pose significant challenges to the practical application of CMP. Therefore, it is imperative to develop an efficient quartz glass polishing slurry that is cost-effective and environmentally friendly. In this study, an efficient polishing slurry was developed containing cerium oxide (CeO₂) abrasive, sodium alginate (ALG), and 5-aminovaleric acid (5-AVA). Notably, the quartz glass material removal rate (MRR) reached 31.57 μm/h after cyclic polishing with the novel slurry. The combination of 5-AVA and ALG forms a complex with a large number of polar groups, as revealed by X-ray photoelectron spectroscopy (XPS), Fourier-transform infrared spectroscopy (FTIR), and Raman spectroscopy. Additionally, the physical properties of MoS₂ nanomaterials were utilized as a buffer layer between the polishing pad and the polished workpiece, reducing friction and thereby improving the surface quality of quartz glass. These findings provide novel insights and concepts for enhancing the performance of CMP in quartz glass applications.

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来源期刊

Applied Surface Science 工程技术-材料科学：膜

CiteScore

12.50

自引率

7.50%

发文量

3393

审稿时长

67 days

期刊介绍： Applied Surface Science covers topics contributing to a better understanding of surfaces, interfaces, nanostructures and their applications. The journal is concerned with scientific research on the atomic and molecular level of material properties determined with specific surface analytical techniques and/or computational methods, as well as the processing of such structures.