Zijian Weng, Marcelo Farfan, Evan Williams, Parinitha Giridharan, Logan G Schmid, David Murphy, Long Wang, Wenbin Mao, Ying Zhong
{"title":"Ultrafast Binder-Free Corona Discharge-Enabled Automated Electrostatic Patterning (AEP) Technique","authors":"Zijian Weng, Marcelo Farfan, Evan Williams, Parinitha Giridharan, Logan G Schmid, David Murphy, Long Wang, Wenbin Mao, Ying Zhong","doi":"10.1021/acsami.4c22698","DOIUrl":null,"url":null,"abstract":"Patterning techniques have garnered extensive attention within the realm of printed electronics owing to their substantial contributions across multifarious applications. A plethora of printing methodologies have emerged to generate intricate 2D patterns, each designed to achieve distinct functionalities. However, most prevailing printing techniques necessitate the utilization of binders, meticulous formulation of ink, compatibility checks with printing nozzles, and rigorous cleaning processes when direct contact methods are employed, all of which consume significant time. This paper introduces an ultrafast binder-free method termed corona discharge-enabled automated electrostatic patterning (AEP), capable of printing sub-100 μm resolution patterns within a mere 2 s time frame. A comprehensive investigation into the mechanism underlying AEP is presented, elucidating its printing principles via theoretical derivations, COMSOL simulations, and high-speed camera observation. The manufacturing of high-quality flexible electronics has also been demonstrated. Because of the autopatterning and binder-free nature of AEP, it can significantly improve the manufacturing efficiency of printed electronics with the advantages of high sensitivity and elimination of the ink drying process and mask abrasion.","PeriodicalId":5,"journal":{"name":"ACS Applied Materials & Interfaces","volume":"58 1","pages":""},"PeriodicalIF":8.3000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Materials & Interfaces","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1021/acsami.4c22698","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Patterning techniques have garnered extensive attention within the realm of printed electronics owing to their substantial contributions across multifarious applications. A plethora of printing methodologies have emerged to generate intricate 2D patterns, each designed to achieve distinct functionalities. However, most prevailing printing techniques necessitate the utilization of binders, meticulous formulation of ink, compatibility checks with printing nozzles, and rigorous cleaning processes when direct contact methods are employed, all of which consume significant time. This paper introduces an ultrafast binder-free method termed corona discharge-enabled automated electrostatic patterning (AEP), capable of printing sub-100 μm resolution patterns within a mere 2 s time frame. A comprehensive investigation into the mechanism underlying AEP is presented, elucidating its printing principles via theoretical derivations, COMSOL simulations, and high-speed camera observation. The manufacturing of high-quality flexible electronics has also been demonstrated. Because of the autopatterning and binder-free nature of AEP, it can significantly improve the manufacturing efficiency of printed electronics with the advantages of high sensitivity and elimination of the ink drying process and mask abrasion.
期刊介绍:
ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.