Rheological and Thermal Behavior of Xanthan Gum Nanofluids Based on Hexagonal Boron Nitride Under High-Pressure and High-Temperature Conditions

IF 2.7 3区 化学 Q2 POLYMER SCIENCE
Yago Chamoun F. Soares, Nathália Maria M. Fernandes, Lara Schimith Berghe, Lidiane Cristina Costa, Fernanda Alice de Credo, Hélio Ribeiro, Mônica Feijó Naccache, Ricardo Jorge E. Andrade
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引用次数: 0

Abstract

Xanthan gum (XG) is a biopolymer widely used in different industries, such as food, cosmetics, oil, among others, which requires modifications in its properties. The present study aims to study the thermal and rheological properties of XG nanofluids based on oxidized hexagonal boron nitride (hBN-oxi) under high temperature and pressure conditions. The hBN-oxi was obtained through liquid exfoliation and then dispersed in the XG at different concentrations. The thermal conductivity of the nanofluids was investigated at different temperatures, and the addition of 6.0 wt% of hBN-oxi in the polymeric system increased thermal conductivity up to 12% at 70°C. The rheological behavior was obtained through steady-state and oscillatory flow measurements to evaluate the effect of hBN-oxi concentration under different temperatures and pressures. At higher concentrations, these nanostructures induced a yield stress in the fluid reaching a value of 12.8 Pa.s. Under high shear rates, the viscosity of the nanofluid decreased by only 16% at 80°C, indicating effective mitigation of temperature effect on viscosity. The pressure influence was also suppressed with the addition of these modified nanoparticles. This study highlights that well-designed formulations can significantly improve performance under extreme conditions.

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来源期刊
Journal of Applied Polymer Science
Journal of Applied Polymer Science 化学-高分子科学
CiteScore
5.70
自引率
10.00%
发文量
1280
审稿时长
2.7 months
期刊介绍: The Journal of Applied Polymer Science is the largest peer-reviewed publication in polymers, #3 by total citations, and features results with real-world impact on membranes, polysaccharides, and much more.
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