Pauline Pradal, Paul Hardivillé, Jong Bin Kim, Seong Kyeong Nam, Shin-Hyun Kim, Esther Amstad
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引用次数: 0
Abstract
Structural colors are bright and possess a remarkable resistance to light exposure, humidity, and temperature such that they constitute an environmentally friendly alternative to chemical pigments. Unfortunately, upscaling the production of photonic structures obtained via conventional colloidal self-assembly is challenging because defects often occur during the assembly of larger structures. Moreover, the processing of materials exhibiting structural colors into intricate 3D structures remains challenging. To address these limitations, rigid photonic microparticles are formulated into an ink that can be 3D printed through direct ink writing (DIW) at room temperature to form intricate macroscopic structures possessing locally varying mechanical and optical properties. This is achieved by adding small amounts of soft microgels to the rigid photonic particles. To rigidify the granular structure, a percolating hydrogel network is formed that covalently connects the microgels. The mechanical properties of the resulting photonic granular materials can be adjusted with the composition and volume fraction of the microgels. The potential of this approach is demonstrated by 3D printing a centimeter-sized photonic butterfly and a temperature-responsive photonic material.
期刊介绍:
Small serves as an exceptional platform for both experimental and theoretical studies in fundamental and applied interdisciplinary research at the nano- and microscale. The journal offers a compelling mix of peer-reviewed Research Articles, Reviews, Perspectives, and Comments.
With a remarkable 2022 Journal Impact Factor of 13.3 (Journal Citation Reports from Clarivate Analytics, 2023), Small remains among the top multidisciplinary journals, covering a wide range of topics at the interface of materials science, chemistry, physics, engineering, medicine, and biology.
Small's readership includes biochemists, biologists, biomedical scientists, chemists, engineers, information technologists, materials scientists, physicists, and theoreticians alike.