{"title":"Effect of temperature on the electrochemical corrosion behavior of Sn-0.7Cu solder alloy in artificial sweat","authors":"Gensheng Wu , Jianjun Xie , Xinxin Zhou , Weiyu Chen , Bo Yu","doi":"10.1016/j.electacta.2025.146150","DOIUrl":null,"url":null,"abstract":"<div><div>The electrochemical corrosion behavior of Sn-0.7Cu solder alloy in pH4.7 and pH7.8 artificial sweat is investigated at different temperatures. The passivation films are formed in both pH4.7 and pH7.8 artificial sweat, and their barrier properties are characterized using several techniques, including potentiodynamic polarization (PDP), potentiostatic polarization (PSP), electrochemical impedance spectroscopy (EIS) and Mott-Schottky (MS) measurements. The results indicate that the anodic polarization curves for Sn-0.7Cu in artificial sweat at all three temperatures exhibit a stable passivation region with a consistent current density. The Nyquist diagram indicates that the diameters of the capacitance arc of the passivation film formed by Sn-0.7Cu follows the order: 30 °C > 20 °C > 40 °C, under the same applied potential. 3D laser confocal imaging of the corroded surfaces reveals the most compact surface at 30 °C in pH7.8 artificial sweat, which is further confirmed by scanning electron microscope (SEM).</div></div>","PeriodicalId":305,"journal":{"name":"Electrochimica Acta","volume":"525 ","pages":"Article 146150"},"PeriodicalIF":5.5000,"publicationDate":"2025-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrochimica Acta","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0013468625005122","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ELECTROCHEMISTRY","Score":null,"Total":0}
引用次数: 0
Abstract
The electrochemical corrosion behavior of Sn-0.7Cu solder alloy in pH4.7 and pH7.8 artificial sweat is investigated at different temperatures. The passivation films are formed in both pH4.7 and pH7.8 artificial sweat, and their barrier properties are characterized using several techniques, including potentiodynamic polarization (PDP), potentiostatic polarization (PSP), electrochemical impedance spectroscopy (EIS) and Mott-Schottky (MS) measurements. The results indicate that the anodic polarization curves for Sn-0.7Cu in artificial sweat at all three temperatures exhibit a stable passivation region with a consistent current density. The Nyquist diagram indicates that the diameters of the capacitance arc of the passivation film formed by Sn-0.7Cu follows the order: 30 °C > 20 °C > 40 °C, under the same applied potential. 3D laser confocal imaging of the corroded surfaces reveals the most compact surface at 30 °C in pH7.8 artificial sweat, which is further confirmed by scanning electron microscope (SEM).
期刊介绍:
Electrochimica Acta is an international journal. It is intended for the publication of both original work and reviews in the field of electrochemistry. Electrochemistry should be interpreted to mean any of the research fields covered by the Divisions of the International Society of Electrochemistry listed below, as well as emerging scientific domains covered by ISE New Topics Committee.