Synthesis of Thick-shell Cu@Ag Particles with Nanorod-shape Surface Morphology for Printed Electronics

IF 5.8 2区 材料科学 Q2 CHEMISTRY, PHYSICAL
Minghan Yu, Jiayun Feng, SenPei Xie, Yiping Wang, Yongsheng Li, Runze Wang, Guofeng Lu, Kang Li, Rui Wu, Weiwei Zhao, Yanhong Tian
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Abstract

This paper introduces a method to synthesize thick-shell Cu@Ag particles, with nanorod-shape silver wrapped on the copper surface after substitution and reduction reactions. The average size of silver nanorods is less than 50 nm and that of the copper particles is about 1 μm. The surface morphology, structure, and sintering properties of Cu@Ag particles were characterized in detail. The results show that the sintering temperature of thick-shell Cu@Ag is 127.5 °C, which is lower than that of Cu@Ag particles covered with island-shape and block-shape silver nanoparticles. The conductive ink was prepared by mixing it with resin paste, and the bulk conductivity of the conductive paste under different sintering conditions was investigated. The optimal -process parameters were chosen to conduct the printing of radio frequency identification (RFID) antennas. The farthest reading distances achieved by the ultra-high frequency RFID (UHF RFID) and the high-frequency RFID (HF RFID) were 9.4 m and 3.5 cm, respectively, which have good prospect of practical application.

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来源期刊
Journal of Alloys and Compounds
Journal of Alloys and Compounds 工程技术-材料科学:综合
CiteScore
11.10
自引率
14.50%
发文量
5146
审稿时长
67 days
期刊介绍: The Journal of Alloys and Compounds is intended to serve as an international medium for the publication of work on solid materials comprising compounds as well as alloys. Its great strength lies in the diversity of discipline which it encompasses, drawing together results from materials science, solid-state chemistry and physics.
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