Phase evolution and enhanced electrostrain characteristics of (0.36-x)BiScO3-0.64PbTiO3-xBaTiO3 ceramic solid solutions

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Subramanian Sasikumar, Min-Seon Lee, Young Hun Jeong
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引用次数: 0

Abstract

Maintaining a high Curie temperature (TC) along with a piezoelectric coefficient (d33) is crucial for the effective application of actuators and sensors. In this study, (0.36-x)BiScO3-0.64PbTiO3-xBaTiO3 ceramics were synthesized via the solid-state reaction method. We thoroughly investigated the influence of BaTiO3 (BT) additions on the structural, dielectric, ferroelectric, electrostrain and piezoelectric properties of ceramics. The X-ray diffraction (XRD) patterns showed that the phase evolution from a coexistence of coexistence of rhombohedral (R) and tetragonal (T) phases to a tetragonal (T) phase as the BT content increasing from 0 to 20%. The temperature-dependent dielectric properties exhibited a diffused phase transition with increasing BT content. The piezoelectric coefficient (d33) is most noticeable at 450 pC/N, with an electromechanical coupling factor (kP) of 57% and a Cuire temperature (TC = 399.5 °C). In addition, a large electrostrain of Smax = 0.23% and a high remanent polarization (Pr) of 54.7 μC/cm2 were observed and stable at x = 0.05. These results suggest that the BS-PT-xBT (0 ≤ x ≤ 0.20) ceramics are promising candidates for high-temperature piezoelectric applications.

Abstract Image

保持高居里温度(TC)和压电系数(d33)对于致动器和传感器的有效应用至关重要。本研究通过固态反应方法合成了 (0.36-x)BiScO3-0.64PbTiO3-xBaTiO3 陶瓷。我们深入研究了添加 BaTiO3 (BT) 对陶瓷的结构、介电、铁电、电应变和压电特性的影响。X 射线衍射(XRD)图显示,随着 BT 含量从 0% 增加到 20%,陶瓷相从斜方体(R)相和四方体(T)相共存演变为四方体(T)相。随着 BT 含量的增加,随温度变化的介电性能表现出扩散相变。压电系数(d33)在 450 pC/N 时最为显著,机电耦合系数(kP)为 57%,奎尔温度(TC = 399.5 ℃)为 399.5 ℃。此外,还观察到 Smax = 0.23% 的大电应变和 54.7 μC/cm2 的高剩电极化 (Pr),并在 x = 0.05 时保持稳定。这些结果表明,BS-PT-xBT(0 ≤ x ≤ 0.20)陶瓷有望用于高温压电应用。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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