Dielectric and microwave absorption properties of Cu@Graphite filled epoxy resin composite coatings

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-03-27 DOI:10.1007/s10854-025-14607-3

Xuan Wang, Liang Zhou, Panting He, Hongbo Wang, Mingze Ma, Yihan Liu

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引用次数: 0

Abstract

With the rapid development of communication technology, concerns regarding electromagnetic radiation pollution have significantly increased. In this study, copper nanoparticles were deposited onto graphite via an electroless plating process to prepare Cu@Graphite/epoxy resin composite coatings with the volume fraction of Cu@Graphite varying from 30 to 60%. The impact of Cu@Graphite content on phase composition, microstructure, and electromagnetic properties was systematically studied. The microwave-absorbing properties of the composite coatings were evaluated, revealing that the composite coating with 50 vol% Cu@Graphite content exhibited optimal performance. Specifically, the composite coating achieved a minimum reflection loss of − 46.39 dB and an effective absorption bandwidth of 2.19 GHz (with a reflection loss below − 10 dB) at a thickness of only 1.7 mm. The results indicate that the investigated Cu@Graphite filled epoxy resin composite coatings exhibit high potential for application as microwave absorbers in the X-band (8.2–12.4 GHz).

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.