{"title":"Development of high-performance soft magnetic composites: influence of binder, CIP content, and nanocrystalline alloy powder size","authors":"Hsing-I. Hsiang, Liang-Fang Fan","doi":"10.1007/s10854-025-14606-4","DOIUrl":null,"url":null,"abstract":"<div><p>This study systematically investigates the effects of binder content, carbonyl iron powder (CIP) content, and FeSiAl nanocrystalline powder particle size on the permeability and core loss of soft magnetic composites (SMCs) for power inductor applications. Unlike previous studies that primarily focus on either composition control or magnetic performance optimization, this research integrates both aspects to develop high-performance SMCs with enhanced magnetic efficiency. The permeability and core loss were quantitatively evaluated, and improvements were assessed by comparing different parameter combinations. The optimized composites, incorporating 40–70 wt% CIP and 1.8–5.0 wt% binder, achieved superior permeability (38.2) and low core loss (286 mW/cm<sup>3</sup> at 100 kHz), making them highly suitable for high-frequency power inductors. The results demonstrate that optimizing the binder content, CIP ratio, and nanocrystalline FeSiAl powder particle size significantly enhances magnetic properties while maintaining mechanical integrity. This study provides valuable insights into the development of advanced SMCs, offering practical improvements in energy efficiency for modern electronic devices.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 9","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14606-4","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This study systematically investigates the effects of binder content, carbonyl iron powder (CIP) content, and FeSiAl nanocrystalline powder particle size on the permeability and core loss of soft magnetic composites (SMCs) for power inductor applications. Unlike previous studies that primarily focus on either composition control or magnetic performance optimization, this research integrates both aspects to develop high-performance SMCs with enhanced magnetic efficiency. The permeability and core loss were quantitatively evaluated, and improvements were assessed by comparing different parameter combinations. The optimized composites, incorporating 40–70 wt% CIP and 1.8–5.0 wt% binder, achieved superior permeability (38.2) and low core loss (286 mW/cm3 at 100 kHz), making them highly suitable for high-frequency power inductors. The results demonstrate that optimizing the binder content, CIP ratio, and nanocrystalline FeSiAl powder particle size significantly enhances magnetic properties while maintaining mechanical integrity. This study provides valuable insights into the development of advanced SMCs, offering practical improvements in energy efficiency for modern electronic devices.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.