Optimization of semi-pendeloque grooved in micro-channel heat sinks for thermal management under optimal pumping power

IF 5.1 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2025-03-22 DOI:10.1016/j.tsep.2025.103531

Injamamul Haque , Naushad Ali , Tabish Alam , Tauseef Uddin Siddiqui , Mushtaq Ahmad Ansari , Jagmohan Yadav , Shivam Srivastava

{"title":"Optimization of semi-pendeloque grooved in micro-channel heat sinks for thermal management under optimal pumping power","authors":"Injamamul Haque , Naushad Ali , Tabish Alam , Tauseef Uddin Siddiqui , Mushtaq Ahmad Ansari , Jagmohan Yadav , Shivam Srivastava","doi":"10.1016/j.tsep.2025.103531","DOIUrl":null,"url":null,"abstract":"<div><div>In the relentless pursuit of efficient thermal management for high-power electronic devices, microchannel heat sinks (MCHS) have emerged as a pivotal solution due to their superior heat dissipation capabilities. This study focuses on optimizing MCHS by incorporating semi-pendeloque grooves on the sidewalls, arranged alternately and designed with varying angles from 10° to 30°. Using numerical technique, the thermal and hydrodynamic performance of these modified MCHSs were quantitatively analyzed. The results reveal that the inclusion of semi-pendeloque grooves significantly enhances the heat transfer rate. At Reynolds number (Re) of 900 and a groove angle of 10°, the Nusselt number increased to 14.17, up from 12.49 at a groove angle of 30°. Additionally, the maximum temperature at the base of the microchannel dropped from 319.82 K at Re = 500 to 313.27 K at Re = 900 with a fixed groove angle of 10°. However, results are also demonstrated that larger groove angle also leads to a marginal higher pressure drop, which means slightly high pumping power is needed. The study suggests that fine-tuning the groove angle and arrangement in microchannel heat sinks can significantly enhance thermal performance, which makes it a promising approach for advanced cooling in electronic devices.</div></div>","PeriodicalId":23062,"journal":{"name":"Thermal Science and Engineering Progress","volume":"61 ","pages":"Article 103531"},"PeriodicalIF":5.1000,"publicationDate":"2025-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermal Science and Engineering Progress","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S245190492500321X","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENERGY & FUELS","Score":null,"Total":0}

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Abstract

In the relentless pursuit of efficient thermal management for high-power electronic devices, microchannel heat sinks (MCHS) have emerged as a pivotal solution due to their superior heat dissipation capabilities. This study focuses on optimizing MCHS by incorporating semi-pendeloque grooves on the sidewalls, arranged alternately and designed with varying angles from 10° to 30°. Using numerical technique, the thermal and hydrodynamic performance of these modified MCHSs were quantitatively analyzed. The results reveal that the inclusion of semi-pendeloque grooves significantly enhances the heat transfer rate. At Reynolds number (Re) of 900 and a groove angle of 10°, the Nusselt number increased to 14.17, up from 12.49 at a groove angle of 30°. Additionally, the maximum temperature at the base of the microchannel dropped from 319.82 K at Re = 500 to 313.27 K at Re = 900 with a fixed groove angle of 10°. However, results are also demonstrated that larger groove angle also leads to a marginal higher pressure drop, which means slightly high pumping power is needed. The study suggests that fine-tuning the groove angle and arrangement in microchannel heat sinks can significantly enhance thermal performance, which makes it a promising approach for advanced cooling in electronic devices.

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.