Bo Ouyang, Haonan Qin, Fengkun Li, Chen Li, Zhaofu Du, Yongqi Zhang, Li Yang, Erjun Kan, Kun Xu, Zhishan Mi
{"title":"Phase-tailored CoCrFeNiAl nitride for enhanced electrocatalytic hydrogen evolution via cooling-mediated plasma strategy","authors":"Bo Ouyang, Haonan Qin, Fengkun Li, Chen Li, Zhaofu Du, Yongqi Zhang, Li Yang, Erjun Kan, Kun Xu, Zhishan Mi","doi":"10.1039/d5nr00153f","DOIUrl":null,"url":null,"abstract":"Modulation of the surface structure of high-entropy-alloy-based nitrides (HEANs) is considered essential for improving electrocatalytic H<small><sub>2</sub></small> production. Compared with thermal nitridation, the plasma technique is a favorable alternative to directly fabricate HEANs, but the excessive surface heating effect during plasma treatment inevitably causes thermally stabilized nitride formation, resulting in deterioration of the highly active structure. To optimize the hydrogen evolution reaction (HER) behavior of HEANs, a facile cooling-mediated plasma strategy is proposed to precisely modulate the HEAN structure (cp-HEAN). The resultant cp-HEAN framework shows a preserved FCC (111) facet and yields an increased amorphous proportion, leading to enhanced HER behavior. In comparison, the normal plasma technique causes FCC lattice distortion with increased precipitation owing to the excessively high surface thermal field (np-HEAN). <em>Operando</em> plasma diagnostics and numerical simulation further confirmed the effect of surface heating on typical plasma parameters and the HEAN framework, indicating that this was the key factor responsible for the high performance of the nitride electrocatalyst.","PeriodicalId":92,"journal":{"name":"Nanoscale","volume":"125 1","pages":""},"PeriodicalIF":5.8000,"publicationDate":"2025-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nanoscale","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1039/d5nr00153f","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Modulation of the surface structure of high-entropy-alloy-based nitrides (HEANs) is considered essential for improving electrocatalytic H2 production. Compared with thermal nitridation, the plasma technique is a favorable alternative to directly fabricate HEANs, but the excessive surface heating effect during plasma treatment inevitably causes thermally stabilized nitride formation, resulting in deterioration of the highly active structure. To optimize the hydrogen evolution reaction (HER) behavior of HEANs, a facile cooling-mediated plasma strategy is proposed to precisely modulate the HEAN structure (cp-HEAN). The resultant cp-HEAN framework shows a preserved FCC (111) facet and yields an increased amorphous proportion, leading to enhanced HER behavior. In comparison, the normal plasma technique causes FCC lattice distortion with increased precipitation owing to the excessively high surface thermal field (np-HEAN). Operando plasma diagnostics and numerical simulation further confirmed the effect of surface heating on typical plasma parameters and the HEAN framework, indicating that this was the key factor responsible for the high performance of the nitride electrocatalyst.
期刊介绍:
Nanoscale is a high-impact international journal, publishing high-quality research across nanoscience and nanotechnology. Nanoscale publishes a full mix of research articles on experimental and theoretical work, including reviews, communications, and full papers.Highly interdisciplinary, this journal appeals to scientists, researchers and professionals interested in nanoscience and nanotechnology, quantum materials and quantum technology, including the areas of physics, chemistry, biology, medicine, materials, energy/environment, information technology, detection science, healthcare and drug discovery, and electronics.