Ambedkar K. Verma, Dev K. Mahato, Sujan Malik, Abhigyan Dutta
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引用次数: 0
Abstract
In this paper, a new Ti-substituted at the Mn site of hole-doped double perovskite La1.5Sr0.5CoMn1-xTixO6 (x = 0.0, 0.5, and 1.0; LSCMT) prepared by solid-state reaction and the effect of Ti-substitution on its structural and electrical transport properties is presented. The structures of La1.5Sr0.5CoMnO6 (LSCMO), La1.5Sr0.5CoMn0.5Ti0.5O6 (LSCMTO), and La1.5Sr0.5CoTiO6 (LSCTO) ceramic oxides were analyzed using powder X-ray diffractometer (PXRD) and phases are confirmed by the Rietveld refinement method and Raman spectroscopy studies. The LSCMO and LSCMTO were refined as monoclinic symmetry (space group P21/n), while in the case of the LSCTO sample the best fitting was obtained for the orthorhombic symmetry (space group Pbnm). The ceramic grains are distributed in the range from 0.2 to 2.2 μm size in scanning electron micrograph(SEM).The temperature (298 to 573 K) and frequency (1 kHz to 1 MHz) dependent dielectric behavior are studied to examine the electrical properties of these ceramic materials. We analyzed the frequency and temperature-dependent electrical data using the framework of conductivity and electric modulus formalisms. The electrical and transport activities in the material are investigated by analyzing the spectra of impedance, modulus, and ac conductivity at varying frequencies and temperatures. The relaxation feature of the material is illustrated through modulus spectroscopic techniques and hopping conduction mechanism is depicted through ac conductivity spectra. The present study examines the effects of Ti-cations with relatable radius at the B/B′ site of La1.5Sr0.5CoMn1-xTixO6 (0 ≤ x ≤ 1.0). The same values of activation energy implies the presence of the same relaxation mechanism in materials with the same charge carriers.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.