Quantifying delamination energy in tungsten on silicon thin films through nanoindentation and nanoscratch

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design Pub Date : 2025-03-25 DOI:10.1016/j.matdes.2025.113873

Shatha Almarri, Matthew Lloyd, Ed Darnbrough, David Armstrong

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Abstract

Quantifying delamination energy is crucial for the reliability and longevity of thin films. In this work, the delamination energy in tungsten-silicon thin films is investigated through nanoindentation and nanoscratching. Nanoindentation was also employed to assess the mechanical properties of the coating through the use of substrate corrections. Energy methods were used to analyse the nanoindentation load displacement curves to quantify the delamination energy. Finite element modelling was used to further improve the accuracy of the calculated delamination energy. Nanoscratching was found to be highly sensitive to the scratch parameters used, and the effect of scratch parameters on the critical load and delamination energy was investigated. It was found that the presence of fragmentation event in nanoscratching led to higher delamination energy values as compared to nanoindentation. Nanoindentation was found to output values closer to that of literature and were additionally not parameter sensitive, making it a reliable method of evaluating thin film adhesion.

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通过纳米压痕和纳米划痕量化硅薄膜上钨的分层能

分层能的量化对薄膜的可靠性和寿命至关重要。在这项工作中，通过纳米压痕和纳米划痕研究了钨硅薄膜的分层能。纳米压痕还通过使用基底修正来评估涂层的机械性能。能量法用于分析纳米压痕载荷位移曲线，以量化分层能量。有限元建模用于进一步提高分层能量计算的准确性。研究发现纳米划痕对所使用的划痕参数非常敏感，并研究了划痕参数对临界载荷和分层能的影响。结果发现，与纳米压痕法相比，纳米划痕法中的碎裂事件会导致更高的分层能值。纳米压痕法的输出值更接近文献值，而且对参数不敏感，是评估薄膜附着力的可靠方法。

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来源期刊

Materials & Design Engineering-Mechanical Engineering

CiteScore

14.30

自引率

7.10%

发文量

1028

审稿时长

85 days

期刊介绍： Materials and Design is a multi-disciplinary journal that publishes original research reports, review articles, and express communications. The journal focuses on studying the structure and properties of inorganic and organic materials, advancements in synthesis, processing, characterization, and testing, the design of materials and engineering systems, and their applications in technology. It aims to bring together various aspects of materials science, engineering, physics, and chemistry. The journal explores themes ranging from materials to design and aims to reveal the connections between natural and artificial materials, as well as experiment and modeling. Manuscripts submitted to Materials and Design should contain elements of discovery and surprise, as they often contribute new insights into the architecture and function of matter.