Influence of Ni content in the CuNi interlayers on the performance of W/RAFM steel joints via vacuum diffusion bonding

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-03-23 DOI:10.1016/j.matlet.2025.138453

Huan Song , Zhang Liu , Yuanyuan Chen , Chenxi Liu , Yuan Huang , Zumin Wang

引用次数: 0

Abstract

CuNi interlayers varying with different Ni contents were used to bond W with reduced activation ferritic/martensitic (RAFM) steel. The influence of Ni content on the microstructure and mechanical properties of W/CuNi/RAFM steel joints was investigated. The results showed that the well-bonded joints were obtained. Increasing the Ni content in the CuNi alloy interlayers enhanced interdiffusion at the interfaces of the W/CuNi/RAFM steel joints, thereby improving their mechanical properties. Specifically, incorporating an interlayer with 68 % Ni content resulted in a shear strength of up to 350 MPa for the joint. The fracture of the joints mainly occurred in the W substrate near the W/CuNi interface.

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铜镍夹层中的镍含量对真空扩散粘接 W/RAFM 钢接头性能的影响

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive