Simplified inverse heat conduction method for interfacial heat transfer coefficient of casting process based on simulated feedback

IF 5.1 3区 工程技术 Q2 ENERGY & FUELS
Yuhao Chen , Kuo Liu , Dunming Liao , Zhijun Ji , Jianhui Zhang
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引用次数: 0

Abstract

Currently, there are many methods for solving the interface heat transfer coefficient, but the classical solution method requires high precision of casting temperature points, needing precise temperature measurements at multiple points on the casting and mold. For complex processes and special pouring environments, achieving stable casting is often difficult. This paper proposes an interfacial heat transfer coefficient solution method based on the secant method and numerical simulation platform. By adjusting the interface heat transfer coefficient, the solidification process of the casting is calculated and a feedback model of the temperature curve is established. A secant method is designed to correct the interface heat transfer coefficient, ensuring accurate fitting of the simulated temperature curve to the target curve, thereby achieving accurate determination of the interface heat transfer coefficient. This method avoids the difficulty of temperature measurement in complex processes and special pouring environments, requiring only the temperature curve of a single point. By comparing assumed interface heat transfer coefficients with the calculation results, it is shown that this method can accurately fit the temperature field, less than 0.1% of the average error in the temperature field and less than 1% of the average error in the interfacial heat transfer coefficient, demonstrating the reliability of the method. Based on the actual temperature measurement results, the curve of titanium alloy investment casting obtained. The final temperature curve fitting accuracy reaches 0.1%, matching well with the actual results, yielding the curve of the interface heat transfer coefficient variation with temperature for TA15 investment casting.
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来源期刊
Thermal Science and Engineering Progress
Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes
CiteScore
7.20
自引率
10.40%
发文量
327
审稿时长
41 days
期刊介绍: Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.
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