Experimental study on the operating performance of a novel flat loop heat pipe with liquid channels under terrestrial and accelerated conditions

IF 5.1 3区 工程技术 Q2 ENERGY & FUELS
Zhen Fang , Yongqi Xie , Jinpeng Wei , Hongwei Wu , Hongxing Zhang , Guoguang Li
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引用次数: 0

Abstract

To address the cooling challenges of future advanced airborne electronic equipment, in this article, a dual compensation chamber stainless steel-ammonia flat loop heat pipe (FLHP) with liquid channels was designed and fabricated. A test rig was set up to evaluate the startup and operating performance under two typical acceleration directions and terrestrial conditions. In the current study, acceleration is defined as direction Ⅰ when it is directed from CC2 to CC1, and as direction Ⅱ is when it oriented from the evaporator to the condenser. Experimental results indicated that: (i) under terrestrial conditions, the FLHP can successfully start at 10 W and quickly reach steady state under varying heat loads (10 ∼ 500 W). (ii) the FLHP successfully started and reached a steady state under 6 g acceleration in both directions, but the time required to reach steady state is longer than that under terrestrial conditions. (iii) the steady-state operating temperature versus heat load shows a “V” shaped curve under both terrestrial and acceleration conditions. The transitions from the variable to the constant conductance model occur at heat loads of 200 W, 400 W, and 300 W for terrestrial condition, acceleration direction Ⅰ, and acceleration direction Ⅱ, respectively. (iv) accelerations in both directions increase the FLHP operating temperature. In direction Ⅰ, acceleration mainly affects the fluid distribution between the CCs, altering heat leakage from the evaporator. In direction II, it primarily increases the flow resistance in the external loop. The findings of this study provide strong support for the thermal management of electronic devices, especially offering broad application prospects in complex and variable airborne acceleration environments.
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来源期刊
Thermal Science and Engineering Progress
Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes
CiteScore
7.20
自引率
10.40%
发文量
327
审稿时长
41 days
期刊介绍: Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.
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