Si3N4 fiber-reinforced epoxy resin composites with different c-BN content for printed circuit board applications

IF 6.5 2区材料科学 Q1 MATERIALS SCIENCE, COMPOSITES

Composites Communications Pub Date : 2025-03-21 DOI:10.1016/j.coco.2025.102355

Qinghe Shi, Kang Jin, Yuxuan Zhang, Hongyan Xia

{"title":"Si3N4 fiber-reinforced epoxy resin composites with different c-BN content for printed circuit board applications","authors":"Qinghe Shi, Kang Jin, Yuxuan Zhang, Hongyan Xia","doi":"10.1016/j.coco.2025.102355","DOIUrl":null,"url":null,"abstract":"<div><div>Fiber-reinforced resin matrix composites are widely used in organic printed circuit boards (PCBs). However, conventional glass fiber reinforced epoxy resin (EP) matrix composites suffer from low thermal conductivity and poor electrical properties. Herein, to coordinate the thermal and electrical properties of the composites, a novel c-BN/EP/Si3N4 composite for PCBs was prepared by hot-pressing moulding method by selecting Si3N4 fibers instead of glass fibers and introducing nano cubic boron nitride (c-BN) particles as filler at the same time. Combined with Si3N4 fibers, nano c-BN filler with suitable content can further improve thermal transfer capacity and limit the volume shrinkage of EP during curing, resulting in the decreased porosity and strong interfacial bonding between Si3N4 fibers and EP. When c-BN content is 20 wt%, the c-BN/EP/Si3N4 composite shows excellent in-plane thermal conductivity (2.124 W m−1 K−1), low coefficient of thermal expansion (4.34 ppm K−1) and excellent breakdown strength (55.71 kV mm−1). Therefore, the c-BN/EP/Si3N4 composites have a potential application in the field of organic PCBs substrates.</div></div>","PeriodicalId":10533,"journal":{"name":"Composites Communications","volume":"56 ","pages":"Article 102355"},"PeriodicalIF":6.5000,"publicationDate":"2025-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Composites Communications","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2452213925001081","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COMPOSITES","Score":null,"Total":0}

引用次数: 0

Abstract

Fiber-reinforced resin matrix composites are widely used in organic printed circuit boards (PCBs). However, conventional glass fiber reinforced epoxy resin (EP) matrix composites suffer from low thermal conductivity and poor electrical properties. Herein, to coordinate the thermal and electrical properties of the composites, a novel c-BN/EP/Si₃N₄ composite for PCBs was prepared by hot-pressing moulding method by selecting Si₃N₄ fibers instead of glass fibers and introducing nano cubic boron nitride (c-BN) particles as filler at the same time. Combined with Si₃N₄ fibers, nano c-BN filler with suitable content can further improve thermal transfer capacity and limit the volume shrinkage of EP during curing, resulting in the decreased porosity and strong interfacial bonding between Si₃N₄ fibers and EP. When c-BN content is 20 wt%, the c-BN/EP/Si₃N₄ composite shows excellent in-plane thermal conductivity (2.124 W m⁻¹ K⁻¹), low coefficient of thermal expansion (4.34 ppm K⁻¹) and excellent breakdown strength (55.71 kV mm⁻¹). Therefore, the c-BN/EP/Si₃N₄ composites have a potential application in the field of organic PCBs substrates.

Abstract Image

查看原文本刊更多论文

求助全文

约1分钟内获得全文求助全文

来源期刊

Composites Communications Materials Science-Ceramics and Composites

CiteScore

12.10

自引率

10.00%

发文量

340

审稿时长

36 days

期刊介绍： Composites Communications (Compos. Commun.) is a peer-reviewed journal publishing short communications and letters on the latest advances in composites science and technology. With a rapid review and publication process, its goal is to disseminate new knowledge promptly within the composites community. The journal welcomes manuscripts presenting creative concepts and new findings in design, state-of-the-art approaches in processing, synthesis, characterization, and mechanics modeling. In addition to traditional fiber-/particulate-reinforced engineering composites, it encourages submissions on composites with exceptional physical, mechanical, and fracture properties, as well as those with unique functions and significant application potential. This includes biomimetic and bio-inspired composites for biomedical applications, functional nano-composites for thermal management and energy applications, and composites designed for extreme service environments.