Modulated electrical transport properties and enhanced thermoelectric performance in tellurium by compositing with copper and doping with antimony

IF 3.8 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Qiang Hu , Manman Yang , Xubiao Zhou , Shangsheng Li , Qinshan Liu , Hongyu Zhu , Taichao Su
{"title":"Modulated electrical transport properties and enhanced thermoelectric performance in tellurium by compositing with copper and doping with antimony","authors":"Qiang Hu ,&nbsp;Manman Yang ,&nbsp;Xubiao Zhou ,&nbsp;Shangsheng Li ,&nbsp;Qinshan Liu ,&nbsp;Hongyu Zhu ,&nbsp;Taichao Su","doi":"10.1016/j.vacuum.2025.114249","DOIUrl":null,"url":null,"abstract":"<div><div>As we know, excellent electrical transport performance is essential for outstanding thermoelectric materials. To date, although commonly used doping strategy can optimize the carrier concentration, which also impact the carrier mobility and thus limit the improvement of thermoelectric performance. In this work, we have incorporated the highly conductive secondary phases of Cu into the Te matrix, specifically targeting an improvement in carrier mobility. It is delightful to report that we have successfully elevated the carrier mobility of Te from 186.9 to 372.6 cm<sup>2</sup>V<sup>−1</sup>s<sup>−1</sup>, and the electrical resistivity was significantly reduced. Furthermore, we have also conducted Cu compositing on the basis of carrier concentration optimization by Sb doping. It reveals that the combination of Cu compositing and Sb doping can further decreases the electrical resistivity by collaboratively optimizing the carrier mobility and carrier concentration. Additionally, the presence of Cu as highly conductive secondary phases within the matrix helps to filter the low-energy electrons and enhance the Seebeck coefficient effectively. Ultimately, we achieved a peak <em>zT</em> of ∼0.82 at 607 K for Te<sub>0.994</sub>Cu<sub>0.003</sub>Sb<sub>0.003</sub>. This research provides a new direction for enhancing the performance of Te-based thermoelectric materials.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":"238 ","pages":"Article 114249"},"PeriodicalIF":3.8000,"publicationDate":"2025-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X25002398","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

As we know, excellent electrical transport performance is essential for outstanding thermoelectric materials. To date, although commonly used doping strategy can optimize the carrier concentration, which also impact the carrier mobility and thus limit the improvement of thermoelectric performance. In this work, we have incorporated the highly conductive secondary phases of Cu into the Te matrix, specifically targeting an improvement in carrier mobility. It is delightful to report that we have successfully elevated the carrier mobility of Te from 186.9 to 372.6 cm2V−1s−1, and the electrical resistivity was significantly reduced. Furthermore, we have also conducted Cu compositing on the basis of carrier concentration optimization by Sb doping. It reveals that the combination of Cu compositing and Sb doping can further decreases the electrical resistivity by collaboratively optimizing the carrier mobility and carrier concentration. Additionally, the presence of Cu as highly conductive secondary phases within the matrix helps to filter the low-energy electrons and enhance the Seebeck coefficient effectively. Ultimately, we achieved a peak zT of ∼0.82 at 607 K for Te0.994Cu0.003Sb0.003. This research provides a new direction for enhancing the performance of Te-based thermoelectric materials.
求助全文
约1分钟内获得全文 求助全文
来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信