Qiang Hu , Manman Yang , Xubiao Zhou , Shangsheng Li , Qinshan Liu , Hongyu Zhu , Taichao Su
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引用次数: 0
Abstract
As we know, excellent electrical transport performance is essential for outstanding thermoelectric materials. To date, although commonly used doping strategy can optimize the carrier concentration, which also impact the carrier mobility and thus limit the improvement of thermoelectric performance. In this work, we have incorporated the highly conductive secondary phases of Cu into the Te matrix, specifically targeting an improvement in carrier mobility. It is delightful to report that we have successfully elevated the carrier mobility of Te from 186.9 to 372.6 cm2V−1s−1, and the electrical resistivity was significantly reduced. Furthermore, we have also conducted Cu compositing on the basis of carrier concentration optimization by Sb doping. It reveals that the combination of Cu compositing and Sb doping can further decreases the electrical resistivity by collaboratively optimizing the carrier mobility and carrier concentration. Additionally, the presence of Cu as highly conductive secondary phases within the matrix helps to filter the low-energy electrons and enhance the Seebeck coefficient effectively. Ultimately, we achieved a peak zT of ∼0.82 at 607 K for Te0.994Cu0.003Sb0.003. This research provides a new direction for enhancing the performance of Te-based thermoelectric materials.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.