Guoyu Cui , Xiang Zhang , Ruixiang He , Guojun Ma , Dingli Zheng , Mengke Liu , Yanghui Xu
{"title":"Kinetics of evaporation removal of Cu and Sn from carbon tool steel under reduced pressure","authors":"Guoyu Cui , Xiang Zhang , Ruixiang He , Guojun Ma , Dingli Zheng , Mengke Liu , Yanghui Xu","doi":"10.1016/j.vacuum.2025.114261","DOIUrl":null,"url":null,"abstract":"<div><div>The removal of residual Cu and Sn from steel is crucial for advancing the recycling of steel scrap and promoting the development and production of clean steel. In this study, the kinetics of evaporative removal of Cu and Sn from carbon tool steel under reduced pressure were investigated. The results show that increasing the smelting temperature and lowering the gas phase pressure significantly enhance the removal efficiency of Cu and Sn from molten steel. The evaporation of Cu and Sn follows first-order reaction kinetics, with both elements evaporating as monatomic molecules. The observed evaporation rate constants for Cu and Sn range from 2.3×10<sup>−6</sup> m·s<sup>−1</sup>∼10.5×10<sup>−6</sup> m·s<sup>−1</sup> and 1.6×10<sup>−6</sup> m·s<sup>−1</sup>∼8.5×10<sup>−6</sup> m·s<sup>−1</sup>, respectively. At a gas phase pressure of 60 Pa and a smelting temperature of 1550 °C∼1650 °C, the apparent evaporation activation energies for Cu and Sn are 192.52 kJ·mol<sup>−1</sup> and 181.84 kJ·mol<sup>−1</sup>, individually. Cu evaporation is restricted by the rate of reaction at the gas-liquid interface. Moreover, within the experimental parameters of this investigation, mass transfer in the liquid phase has negligible influence on Cu and Sn evaporation.</div></div>","PeriodicalId":23559,"journal":{"name":"Vacuum","volume":"238 ","pages":"Article 114261"},"PeriodicalIF":3.8000,"publicationDate":"2025-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Vacuum","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0042207X25002519","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The removal of residual Cu and Sn from steel is crucial for advancing the recycling of steel scrap and promoting the development and production of clean steel. In this study, the kinetics of evaporative removal of Cu and Sn from carbon tool steel under reduced pressure were investigated. The results show that increasing the smelting temperature and lowering the gas phase pressure significantly enhance the removal efficiency of Cu and Sn from molten steel. The evaporation of Cu and Sn follows first-order reaction kinetics, with both elements evaporating as monatomic molecules. The observed evaporation rate constants for Cu and Sn range from 2.3×10−6 m·s−1∼10.5×10−6 m·s−1 and 1.6×10−6 m·s−1∼8.5×10−6 m·s−1, respectively. At a gas phase pressure of 60 Pa and a smelting temperature of 1550 °C∼1650 °C, the apparent evaporation activation energies for Cu and Sn are 192.52 kJ·mol−1 and 181.84 kJ·mol−1, individually. Cu evaporation is restricted by the rate of reaction at the gas-liquid interface. Moreover, within the experimental parameters of this investigation, mass transfer in the liquid phase has negligible influence on Cu and Sn evaporation.
期刊介绍:
Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences.
A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below.
The scope of the journal includes:
1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes).
2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis.
3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification.
4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.