Zhaoyang Liu , Zhanhao Wen , Bao Chen , Jiang Xu , Zedong Wang , Xuqiang Zheng
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引用次数: 0
Abstract
This paper proposes a dual-channel very short reach (VSR) SerDes transceiver designed for chip-to-chip (C2C) or chip-to-module (C2M) interconnections. The transmitter utilizes a half-rate architecture and is composed of high-speed multiplexers (MUXs), a clock distribution module, and an adjustable 3-tap feed-forward equalizer (FFE). The proposed receiver employs a half-rate oversampling architecture, consisting of a continuous time linear equalizer (CTLE), a CML-based static comparator, high-speed demultiplexers (DEMUXs), a multiphase clock generation module based on an active polyphase filter (APFF), a phase interpolator (PI), and a clock and data recovery (CDR) loop. This dual-channel transceiver is designed with a 28-nm CMOS process technology and supplied with 1/1.2 V. Post-simulation results show that this transceiver can operate at a data rate of 32 Gb/s with a power efficiency of 1.81 pJ/bit for transmitter and 3.5 pJ/bit for receiver. The transceiver’s BER is less than 1E-12 and eye-wide-opening is 0.86 UI, which is under 12.4 dB channel loss at 16 GHz Nyquist frequency.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.