Yuhao Yang , Yongle Wu , Weimin Wang , Shiyu Xie , Yuanan Liu
{"title":"Design of a dual-band filter based on mode composite structure combining substrate integrated waveguides and slotlines","authors":"Yuhao Yang , Yongle Wu , Weimin Wang , Shiyu Xie , Yuanan Liu","doi":"10.1016/j.mejo.2025.106650","DOIUrl":null,"url":null,"abstract":"<div><div>This paper proposes a novel mode composite structure that combines substrate integrated waveguides (SIWs) and slotlines, offering a compact solution for a dual-band filter targeting both microwave and millimeter-wave bands. The TEM mode of slotlines and TE modes of SIWs within a single substrate layer are transmitted simultaneously. They can share ports, feeding circuits and feeding apertures, which means the proposed structure is compact, offering efficient integration. Particularly, slotlines embedded are capable of generating low-frequency resonances with feeding circuits, and are able to regulate the field distributions of TE modes in high bands. The performance of the filter is validated through simulation and measurement, demonstrating bandwidths from 15.49 GHz to 17.42 GHz and from 33.05 GHz to 35.10 GHz, with excellent out-of-band rejection more than 20.24 dB. It is suitable for Ku and Ka applications.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"159 ","pages":"Article 106650"},"PeriodicalIF":1.9000,"publicationDate":"2025-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239125000992","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This paper proposes a novel mode composite structure that combines substrate integrated waveguides (SIWs) and slotlines, offering a compact solution for a dual-band filter targeting both microwave and millimeter-wave bands. The TEM mode of slotlines and TE modes of SIWs within a single substrate layer are transmitted simultaneously. They can share ports, feeding circuits and feeding apertures, which means the proposed structure is compact, offering efficient integration. Particularly, slotlines embedded are capable of generating low-frequency resonances with feeding circuits, and are able to regulate the field distributions of TE modes in high bands. The performance of the filter is validated through simulation and measurement, demonstrating bandwidths from 15.49 GHz to 17.42 GHz and from 33.05 GHz to 35.10 GHz, with excellent out-of-band rejection more than 20.24 dB. It is suitable for Ku and Ka applications.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.