Two sides in one coin: Emerging biomimetic multistage ordered microstructure-based adhesion and microfluidics

IF 4.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Sensors and Actuators A-physical Pub Date : 2025-03-21 DOI:10.1016/j.sna.2025.116496

Meng Wei, Tong Wu, Baoyang Lin, Qian Zhou, Bingbing Gao

{"title":"Two sides in one coin: Emerging biomimetic multistage ordered microstructure-based adhesion and microfluidics","authors":"Meng Wei, Tong Wu, Baoyang Lin, Qian Zhou, Bingbing Gao","doi":"10.1016/j.sna.2025.116496","DOIUrl":null,"url":null,"abstract":"<div><div>Bionic structures significantly influence the design of intelligent sensing patches, particularly through biomimetic microstructures. These microstructures enhance adhesion by forming robust microscale connections while maintaining macroscale stability. The porous nature of these materials facilitates liquid flow, enabling their use in microfluidic devices. This structural adhesion minimizes contamination, improving microfluidic signal accuracy. Despite these advantages, challenges remain in maintaining performance under high humidity, oil contamination, and extreme temperatures. Additionally, integrating biomimetic structures with microfluidic systems poses scalability and complexity obstacles. Numerous studies have focused on bionic adhesion in health-monitoring systems, examining material composition, adhesion mechanisms, and isolated microfluidic applications, but a comprehensive review addressing the synergistic contributions of multistage bionic structures to both adhesion and microfluidic performance is lacking. This paper reviews recent advancements in multistage bionic structures for adhesion and microfluidic integration, focusing on design improvements and potential applications. It analyzes the impact of common, composite, and multilevel ordered structures on adhesion and microfluidic properties. Finally, this study highlights the potential of these innovations to guide future research in the development of efficient, scalable, and multifunctional bionic systems for industrial and biomedical applications.</div></div>","PeriodicalId":21689,"journal":{"name":"Sensors and Actuators A-physical","volume":"388 ","pages":"Article 116496"},"PeriodicalIF":4.1000,"publicationDate":"2025-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Actuators A-physical","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0924424725003024","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

Abstract

Bionic structures significantly influence the design of intelligent sensing patches, particularly through biomimetic microstructures. These microstructures enhance adhesion by forming robust microscale connections while maintaining macroscale stability. The porous nature of these materials facilitates liquid flow, enabling their use in microfluidic devices. This structural adhesion minimizes contamination, improving microfluidic signal accuracy. Despite these advantages, challenges remain in maintaining performance under high humidity, oil contamination, and extreme temperatures. Additionally, integrating biomimetic structures with microfluidic systems poses scalability and complexity obstacles. Numerous studies have focused on bionic adhesion in health-monitoring systems, examining material composition, adhesion mechanisms, and isolated microfluidic applications, but a comprehensive review addressing the synergistic contributions of multistage bionic structures to both adhesion and microfluidic performance is lacking. This paper reviews recent advancements in multistage bionic structures for adhesion and microfluidic integration, focusing on design improvements and potential applications. It analyzes the impact of common, composite, and multilevel ordered structures on adhesion and microfluidic properties. Finally, this study highlights the potential of these innovations to guide future research in the development of efficient, scalable, and multifunctional bionic systems for industrial and biomedical applications.

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来源期刊

Sensors and Actuators A-physical 工程技术-工程：电子与电气

CiteScore

8.10

自引率

6.50%

发文量

630

审稿时长

49 days

期刊介绍： Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...