Development of low-dielectric polyimide composites based on perfluorosilane coupling agent sealed mesoporous silica

IF 2.7 4区材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Letters Pub Date : 2025-03-18 DOI:10.1016/j.matlet.2025.138420

Xianwu Cao, Zijie Wang, Qilong Huang, Wanjing Zhao, Zhitao Yang

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Abstract

The exponential expansion of the telecommunications electronics and industry has driven a surge in demand for low dielectric thin film materials, which are extensively employed as interlayer dielectrics in electronic packaging, as sealing materials, and as substrates for flexible copper-clad laminates. In this paper, mesoporous silica with hollow nanopore structure (MCM-41), sealed with perfluorosilane coupling agent, was introduced into polyimide (PI) matrix by in-situ polymerization to prepare modified MCM-41/PI composite films. The longer fluorine-containing branched chain in 1H,1H,2H,2H-perfluorodecyltrimethoxysilane (THFS) brings better interfacial compatibility and dispersion compared to 1H,1H,2H,2H-perfluorooctyltrimethoxysilane (TTFS). As a result, the PI composite film containing 3 wt% of MCM@THFS (MCM@THFS/PI-3) shows the excellent comprehensive performance among all films, with its dielectric constant decreasing to 2.14@1 MHz, its coefficient of thermal expansion (CTE) value decreasing to 50.78 ppm/K, and its water contact angle improving to 85.43°. Obviously, MCM@THFS/PI-3 shows great potential for application in the field of low dielectric.

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来源期刊

Materials Letters 工程技术-材料科学：综合

CiteScore

5.60

自引率

3.30%

发文量

1948

审稿时长

50 days

期刊介绍： Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive