Effect and mechanism of shuttle-heterostructure interfacial microalloying on mechanical properties of Cu/Ti composite plates prepared by accumulative roll bonding process

IF 6.1 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Science and Engineering: A Pub Date : 2025-03-18 DOI:10.1016/j.msea.2025.148239

Yingming Tu , Ke Cheng , Min Cui , Jie Zhao , Zihan Liu , Tongguang Zhai , Cainian Jing

{"title":"Effect and mechanism of shuttle-heterostructure interfacial microalloying on mechanical properties of Cu/Ti composite plates prepared by accumulative roll bonding process","authors":"Yingming Tu , Ke Cheng , Min Cui , Jie Zhao , Zihan Liu , Tongguang Zhai , Cainian Jing","doi":"10.1016/j.msea.2025.148239","DOIUrl":null,"url":null,"abstract":"<div><div>Heterostructure design has an apparent effect on mechanical properties. Cu/Ti composite plates with shuttle-heterostructure (SH) were prepared by accumulative roll bonding (ARB) process. Interfacial microalloying was carried out by vacuum diffusion heat treatment comparatively, and the intrinsic mechanisms on microstructure and mechanical properties were revealed. The results show that high-density multiscale SHs are formed by Ti layers necking fracture due to the interfacial shear effect generated by ARB at room temperature. After interfacial microalloying, the elemental diffusion width at SH interfaces rises by 323 %, and a slight increase in recrystallized structures is observed. The yield strength, tensile strength and elongation are improved by 2.6 %, 10.8 % and 110 %, respectively, and the electrical conductivity is maintained at about 94 % IACS. The enhanced plastic deformability and the high level of uniform strain-hardening effect improve the plasticity of Cu/Ti composite plates. Intense metallurgical bonding at SH interfaces permits Cu/Ti composite plates to withstand greater loads for a long time. A stronger heterogeneous deformation-induced (HDI) strengthening and strain hardening effects are obtained after interfacial microalloying of SHs. It is an effective way to prepare high electrical conductivity materials with advanced strength and plasticity.</div></div>","PeriodicalId":385,"journal":{"name":"Materials Science and Engineering: A","volume":"931 ","pages":"Article 148239"},"PeriodicalIF":6.1000,"publicationDate":"2025-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science and Engineering: A","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0921509325004630","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}

引用次数: 0

Abstract

Heterostructure design has an apparent effect on mechanical properties. Cu/Ti composite plates with shuttle-heterostructure (SH) were prepared by accumulative roll bonding (ARB) process. Interfacial microalloying was carried out by vacuum diffusion heat treatment comparatively, and the intrinsic mechanisms on microstructure and mechanical properties were revealed. The results show that high-density multiscale SHs are formed by Ti layers necking fracture due to the interfacial shear effect generated by ARB at room temperature. After interfacial microalloying, the elemental diffusion width at SH interfaces rises by 323 %, and a slight increase in recrystallized structures is observed. The yield strength, tensile strength and elongation are improved by 2.6 %, 10.8 % and 110 %, respectively, and the electrical conductivity is maintained at about 94 % IACS. The enhanced plastic deformability and the high level of uniform strain-hardening effect improve the plasticity of Cu/Ti composite plates. Intense metallurgical bonding at SH interfaces permits Cu/Ti composite plates to withstand greater loads for a long time. A stronger heterogeneous deformation-induced (HDI) strengthening and strain hardening effects are obtained after interfacial microalloying of SHs. It is an effective way to prepare high electrical conductivity materials with advanced strength and plasticity.

查看原文本刊更多论文

求助全文

约1分钟内获得全文求助全文

来源期刊

Materials Science and Engineering: A 工程技术-材料科学：综合

CiteScore

11.50

自引率

15.60%

发文量

1811

审稿时长

31 days

期刊介绍： Materials Science and Engineering A provides an international medium for the publication of theoretical and experimental studies related to the load-bearing capacity of materials as influenced by their basic properties, processing history, microstructure and operating environment. Appropriate submissions to Materials Science and Engineering A should include scientific and/or engineering factors which affect the microstructure - strength relationships of materials and report the changes to mechanical behavior.