{"title":"Enhanced high-temperature service reliability of sinter-bonded joints with micro-nano hybrid Ag paste","authors":"Shuang Xi , Xingwang Shen , Junjie Li","doi":"10.1016/j.mseb.2025.118220","DOIUrl":null,"url":null,"abstract":"<div><div>There are inevitable cracking defects in pressureless bonded joints with single nanoparticle system silver (Ag) pastes, which could potentially compromise the long-term service reliability of the bonded joints. To address this issue, a novel hybrid Ag paste suitable for pressureless sintering was developed by introducing micron Ag flakes into the modified Ag nanoparticles. The effects of process parameters, such as the mass ratio of Ag nanoparticles to micron-sized Ag flakes in the paste and the sintering time, on the electrical performance of the sintered films and the bonding performance of the joints were investigated. The mechanism of sintering reliability enhancement of micro-nano hybrid Ag paste was also investigated. After a long time of high-temperature aging, micro-nano hybrid Ag paste joints with optimized micro/nano ratio exhibit reduced surface defects (with porosity of 22.19 % for hybrid Ag paste joints while 28.67 % for nano-Ag paste joints), which contributes to the enhanced mechanical stability compared to nano-Ag paste bonded joints (with shear strength of 45.78 MPa for hybrid Ag paste joints while 33.38 MPa for nano-Ag paste joints). The obtained hybrid Ag paste with high mechanical service reliability and superior repeatability would find a broad application prospect in the field of power device packaging.</div></div>","PeriodicalId":18233,"journal":{"name":"Materials Science and Engineering: B","volume":"317 ","pages":"Article 118220"},"PeriodicalIF":3.9000,"publicationDate":"2025-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science and Engineering: B","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0921510725002430","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
There are inevitable cracking defects in pressureless bonded joints with single nanoparticle system silver (Ag) pastes, which could potentially compromise the long-term service reliability of the bonded joints. To address this issue, a novel hybrid Ag paste suitable for pressureless sintering was developed by introducing micron Ag flakes into the modified Ag nanoparticles. The effects of process parameters, such as the mass ratio of Ag nanoparticles to micron-sized Ag flakes in the paste and the sintering time, on the electrical performance of the sintered films and the bonding performance of the joints were investigated. The mechanism of sintering reliability enhancement of micro-nano hybrid Ag paste was also investigated. After a long time of high-temperature aging, micro-nano hybrid Ag paste joints with optimized micro/nano ratio exhibit reduced surface defects (with porosity of 22.19 % for hybrid Ag paste joints while 28.67 % for nano-Ag paste joints), which contributes to the enhanced mechanical stability compared to nano-Ag paste bonded joints (with shear strength of 45.78 MPa for hybrid Ag paste joints while 33.38 MPa for nano-Ag paste joints). The obtained hybrid Ag paste with high mechanical service reliability and superior repeatability would find a broad application prospect in the field of power device packaging.
期刊介绍:
The journal provides an international medium for the publication of theoretical and experimental studies and reviews related to the electronic, electrochemical, ionic, magnetic, optical, and biosensing properties of solid state materials in bulk, thin film and particulate forms. Papers dealing with synthesis, processing, characterization, structure, physical properties and computational aspects of nano-crystalline, crystalline, amorphous and glassy forms of ceramics, semiconductors, layered insertion compounds, low-dimensional compounds and systems, fast-ion conductors, polymers and dielectrics are viewed as suitable for publication. Articles focused on nano-structured aspects of these advanced solid-state materials will also be considered suitable.