Wenbao Geng , Yulong Li , Jia Xiong , Wei Wei , Boyu Zhao , Jiawei Xu , Xiaoxin Li , Huayu Zhang
{"title":"Study on the hygrothermal aging mechanism of photo-thermal dual-curing solder mask","authors":"Wenbao Geng , Yulong Li , Jia Xiong , Wei Wei , Boyu Zhao , Jiawei Xu , Xiaoxin Li , Huayu Zhang","doi":"10.1016/j.porgcoat.2025.109241","DOIUrl":null,"url":null,"abstract":"<div><div>Photo-thermal dual-curing solder masks with high resolution and excellent mechanical properties are widely used in semiconductor advanced packaging applications. The reliability of electronic products in high temperature and high humidity environments has always been the focus of research in the semiconductor industry. The structural transformation of solder mask as the protection of package substrate lines under high temperature and humidity environment is particularly important. This paper focuses on the hygrothermal aging process and mechanism of photo-thermal dual-curing solder masks. The effects of time, temperature and humidity on the structural and mechanical properties of solder masks during the hygrothermal aging process are thoroughly investigated. After being treated at high temperature and humidity for 168 h, the ester group as cross-linking point in the photo-thermal dual-curing solder mask hydrolyzes to generate carboxyl and hydroxyl group. The crosslink density of the solder mask reduces from 48.42 × 10<sup>−4</sup> mol/ml to 29.27 × 10<sup>−4</sup> mol/ml. Additionally, solder masks are not hydrolysed after being treated at high temperature or humidity for 168 h. Aging of solder masks only occurs when they are treated at high temperature and humidity and when the temperature and humidity reach the threshold values. This study provides a guiding reference for the application of solder masks in the field of advanced packaging.</div></div>","PeriodicalId":20834,"journal":{"name":"Progress in Organic Coatings","volume":"204 ","pages":"Article 109241"},"PeriodicalIF":6.5000,"publicationDate":"2025-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Progress in Organic Coatings","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0300944025001900","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, APPLIED","Score":null,"Total":0}
引用次数: 0
Abstract
Photo-thermal dual-curing solder masks with high resolution and excellent mechanical properties are widely used in semiconductor advanced packaging applications. The reliability of electronic products in high temperature and high humidity environments has always been the focus of research in the semiconductor industry. The structural transformation of solder mask as the protection of package substrate lines under high temperature and humidity environment is particularly important. This paper focuses on the hygrothermal aging process and mechanism of photo-thermal dual-curing solder masks. The effects of time, temperature and humidity on the structural and mechanical properties of solder masks during the hygrothermal aging process are thoroughly investigated. After being treated at high temperature and humidity for 168 h, the ester group as cross-linking point in the photo-thermal dual-curing solder mask hydrolyzes to generate carboxyl and hydroxyl group. The crosslink density of the solder mask reduces from 48.42 × 10−4 mol/ml to 29.27 × 10−4 mol/ml. Additionally, solder masks are not hydrolysed after being treated at high temperature or humidity for 168 h. Aging of solder masks only occurs when they are treated at high temperature and humidity and when the temperature and humidity reach the threshold values. This study provides a guiding reference for the application of solder masks in the field of advanced packaging.
期刊介绍:
The aim of this international journal is to analyse and publicise the progress and current state of knowledge in the field of organic coatings and related materials. The Editors and the Editorial Board members will solicit both review and research papers from academic and industrial scientists who are actively engaged in research and development or, in the case of review papers, have extensive experience in the subject to be reviewed. Unsolicited manuscripts will be accepted if they meet the journal''s requirements. The journal publishes papers dealing with such subjects as:
• Chemical, physical and technological properties of organic coatings and related materials
• Problems and methods of preparation, manufacture and application of these materials
• Performance, testing and analysis.