Structure, thermal and dielectric studies of low-density polyethylene/cobalt ferrite hybrid nanocomposites

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Taha Abdel Mohaymen Taha, Akram S. Sharaf, S. El-Rabaie, A. Hassona
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Abstract

This study elucidates the synthesis of CoFe2O4 nanoparticles via a sol–gel method using gelatin fuel and explores their incorporation into low-density polyethylene (LDPE) at varying weight percentages (0.0 wt % to 7.0 wt %). Systematic characterization was completed using X-ray diffraction (XRD), transmission electron microscopy (TEM), scanning electron microscopy (SEM), Fourier-transform infrared spectroscopy (FTIR), Raman spectroscopy, thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), and dielectric measurements. XRD patterns of CoFe2O4 nanoparticles exhibited diffraction peaks corresponding to the spinel structure. The average crystal size of CoFe2O4 in LDPE nanocomposites was 16–24 nm (Scherrer equation) and 15–55 nm (Williamson-Hall method). TEM analysis estimated the mean size of CoFe2O4 nanoparticles to be 17 nm. SEM images revealed nanoparticle-polymer interactions, particle distribution, and agglomeration at higher concentrations. TGA results indicated a marked increase in the decomposition temperature of LDPE composites. DSC analysis further demonstrates enhanced melting temperature (108–111 °C). The real part of the dielectric constant (ε1) decreased up to 3 wt % of CoFe2O4 and then increased. The imaginary part of the dielectric permittivity (ε2) increased with higher CoFe2O4 nanoparticle content. The resulting materials exhibit promising applications in electronics, energy storage, and electromagnetic shielding.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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