Preparation and wave-absorbing properties of OPCS@CoFe2O4 core–shell structured wave-absorbing materials with multiple loss mechanisms

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiahao Cui, Dong Zhao, Fengcao Zhang, Qianyi Feng, Xinyu Zhu, Junyan Zhou, Zhongqing Liu
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引用次数: 0

Abstract

Great concerns have arisen in wave-absorbing materials due to the increasing number of electromagnetic wave pollution. Porous carbon microspheres (PCS) are considered an excellent wave-absorbing material due to their unique hollow porous structure, but their loss mechanism is relatively single. The aim of present study was to investigate how to enrich the loss mechanism of PCS as well as to expand its absorption bandwidth. In this work, we prepared oxidized porous carbon microspheres (OPCS) with multiple loss mechanisms by chemical etching of PCS using potassium permanganate, on this basis, OPCS@CoFe2O4 magnetic composites with core–shell structure and magnetic-dielectric dual-loss mechanism were prepared by one-step hydrothermal method. With the minimum reflection loss (RLmin) of -45.42 dB at the matched thickness of 2.3 mm, and the effective absorption bandwidth (EAB) of 6.3 GHz at the matched thickness of 2.5 mm. Therefore, the present study provides ideas and references for the preparation of wave-absorbing materials with multiple loss mechanisms to realize broadband absorption.

由于电磁波污染日益严重,吸波材料备受关注。多孔碳微球(PCS)因其独特的中空多孔结构而被认为是一种优秀的吸波材料,但其损耗机制相对单一。本研究旨在探讨如何丰富多孔碳微球的损耗机制,并扩大其吸收带宽。本研究利用高锰酸钾对 PCS 进行化学蚀刻,制备了具有多种损耗机制的氧化多孔碳微球(OPCS),并在此基础上通过一步水热法制备了具有核壳结构和磁介质双损耗机制的 OPCS@CoFe2O4 磁性复合材料。在匹配厚度为 2.3 mm 时,其最小反射损耗(RLmin)为 -45.42 dB;在匹配厚度为 2.5 mm 时,其有效吸收带宽(EAB)为 6.3 GHz。因此,本研究为制备具有多种损耗机制的吸波材料以实现宽带吸波提供了思路和参考。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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