Surface hydroxylation of polymer-derived SiCN ceramics to improve the dielectric performance of the SiCN/PVDF composites

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Weiye Zhang, Dandan Sun, Jiahe Shen, Weiliang Liu, Jiale Yang
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引用次数: 0

Abstract

Dielectric capacitors have attracted considerable attention in recent years due to their safety, environmental friendliness, high power density, and long service life. However, constrained by the limitations of dielectric materials, the energy storage density of the dielectric capacitors remains suboptimal. Therefore, the development of novel high-performance dielectric materials is imperative. In this work, surface-hydroxylated SiCN ceramics (H-SiCN) were employed as fillers, and H-SiCN/PVDF composites displaying superior dielectric attributes and considerable energy storage density were attained via a hot-pressing technique. After the surface hydroxylation of SiCN, the permittivity of the H-SiCN/PVDF composites increases slightly, the dielectric loss decreases, and the breakdown strength enhances significantly. When the volume fraction of H-SiCN is 20 vol%, the H-SiCN/PVDF composite film achieves the maximum energy storage of 12.23 J cm−3, which is increased by 101.2% compared to that of the SiCN/PVDF composite film. Robust hydrogen bonds are formed between the F atoms of PVDF and the hydroxyl groups on the surface of SiCN, which strengthens the interfacial combination between them and promotes polarization intensity. This work may provide reference significance for the design of high-performance dielectric materials.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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