Development of high-performance Cu nanoparticle paste and low-temperature sintering for Cu–Cu bonding

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Materials Science: Materials in Electronics Pub Date : 2025-03-24 DOI:10.1007/s10854-025-14586-5

Jiaqiang Huang, Zhiling Ning, Caiping Yu, Dongjing Liu, Yujie Liu, Dawei Xiao

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引用次数: 0

Abstract

The sintering technology of Cu nanoparticle paste has significant potential for application in wide bandgap semiconductor devices. In this study, a high-performance and multi-scale Cu nanoparticle paste is proposed to solve the critical issues of easy oxidation during preparation and storage, as well as high sintering temperature. The multi-scale Cu nanoparticles with sizes ranging from 20 to 140 nm were synthesized simply and efficiently using a liquid-phase reduction method. These nanoparticles were subsequently mixed with a reducing composite solvent to develop a Cu nanoparticle paste. Based on this paste, pressure-assisted Cu–Cu bonding experiments were conducted at various temperatures and durations. The Cu–Cu joints achieve an average shear strength of 33.3 MPa after sintering at 240 °C in a nitrogen atmosphere and even exceed 60 MPa when the temperature is raised to 280 ℃. Additionally, with a reductive surface coating, the multi-scale Cu nanoparticles can be stored for over 20 days under ambient air condition. Besides, the enhanced bonding strength and dense microstructure are attributed to the close-packing effect of multi-scale nanoparticles and the facilitation of small size nanoparticles. The proposed multi-scale Cu nanoparticle paste exhibits excellent oxidation resistance and low-temperature sintering performance, which demonstrates significant potential for application in power device packaging and interconnection.

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铜纳米粒子浆料的烧结技术在宽带隙半导体器件中有着巨大的应用潜力。本研究提出了一种高性能多尺度铜纳米粒子浆料，以解决制备和储存过程中易氧化以及烧结温度高等关键问题。采用液相还原法简单高效地合成了尺寸为 20 至 140 nm 的多尺度铜纳米粒子。这些纳米粒子随后与还原复合溶剂混合，形成了铜纳米粒子浆料。基于这种浆料，在不同温度和持续时间下进行了压力辅助铜-铜接合实验。在氮气环境下于 240 ℃ 烧结后，铜-铜接头的平均剪切强度达到 33.3 MPa，当温度升至 280 ℃ 时，平均剪切强度甚至超过 60 MPa。此外，在还原表面涂层的作用下，多尺度铜纳米粒子可在环境空气条件下保存 20 天以上。此外，多尺度纳米粒子的紧密堆积效应和小尺寸纳米粒子的促进作用增强了粘合强度和致密的微观结构。所提出的多尺度铜纳米粒子浆料具有优异的抗氧化性和低温烧结性能，在功率器件封装和互连方面具有巨大的应用潜力。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.