Elham M. A. Dannoun, R. M’nassri, Muaffaq M. Nofal
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引用次数: 0
Abstract
The electrocaloric effect (ECE) offers a promising avenue for developing energy-efficient solid-state refrigeration technologies. This study employs an artificial neural network (ANN) approach to investigate the electric field dependence of the electrocaloric effect (ECE) in Mn/Y co-doped Ba0.67Sr0.33TiO3 ceramics. By analysing isothermal polarization data, the ANN model accurately predicts key electrocaloric metrics, including entropy change (ΔS), temperature change (ΔT), and heat-carrying capacity (ΔQ), across a range of electric fields. The co-doping of Mn and Y enhances the microstructure, reduces leakage current, and broadens the temperature span of the ceramics, thereby improving the performance of the electrocaloric effect (ECE). The doped ceramics exhibit considerable ECE around room temperature and a relatively broad electrocaloric temperature range. The figures of merit, including the refrigerant capacity and temperature-averaged entropy change, increase with the applied field strength. Furthermore, the study investigates the field dependence of entropy change ΔS and confirms the second-order character of the electric phase transition through master curve analysis. The ANN method is demonstrated to be a rapid and accurate tool for characterising electrocaloric materials, reducing experimental time, and enhancing the optimisation of novel materials. These findings highlight the potential of Mn/Y co-doped Ba0.67Sr0.33TiO3 ceramics in developing environmentally friendly and energy-efficient refrigeration technologies.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.