{"title":"A Chiplet Platform for Intelligent Radar/Sonar Leveraging Domain-Specific Reusable Active Interposer","authors":"Yafei Liu;Dejian Li;Zheng Yang;Chaoqin Zhang;Yunlai Zhang;Xiangyu Li;Mingwei Cao;Shouyi Yin","doi":"10.1109/TVLSI.2025.3529699","DOIUrl":null,"url":null,"abstract":"Through chiplet reuse, chiplet-based system designs have emerged as a cost-effective solution for system-on-chips (SoCs), yet considerable silicon interposer costs often negate the benefits. Though general reusable interposers (GRIs) can lower the cost, they often compromise on performance and energy efficiency. In this article, a domain-specific reusable active interposer (active DSRI) approach is proposed for a better cost-efficiency tradeoff. Moreover, a chiplet platform based on an active DSRI designed for the intelligent radar/sonar (IRS) domain is introduced to facilitate rapid and customized SoC development. This platform offers flexible and energy-efficient interconnections tailored for IRS, platform infrastructure functions, and peripherals to simplify the chiplets. Furthermore, it integrates lightweight, composable standard 3-D interfaces across the chiplets and interposer, delivering up to 96-Gb/s bandwidth, 11.1-ns latency, and 0.62-pJ/bit energy efficiency, well controlling the cost and power penalties of SoC partition. Demonstrated with a customized hand gesture recognition sonar system (HGRSS) baseband SoC implemented on the proposed platform, it achieves similar performance to a monolithic SoC, with a recognition frame rate of 6286 frames/s, where overhead of the 3-D interface is only 6.86% in area and 4.84% in power. Our approach proves cost-effective, energy efficient, and customizable, moving system volume breakeven point forward by <inline-formula> <tex-math>$3.22\\sim 3.36$ </tex-math></inline-formula> times, and reducing the cost by 58.5%~59.8%. This represents a pioneering demonstration of reusable chiplets in HGRSS, showcasing the potential of our approach for broader domains.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 4","pages":"903-915"},"PeriodicalIF":2.8000,"publicationDate":"2025-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10851388/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
Through chiplet reuse, chiplet-based system designs have emerged as a cost-effective solution for system-on-chips (SoCs), yet considerable silicon interposer costs often negate the benefits. Though general reusable interposers (GRIs) can lower the cost, they often compromise on performance and energy efficiency. In this article, a domain-specific reusable active interposer (active DSRI) approach is proposed for a better cost-efficiency tradeoff. Moreover, a chiplet platform based on an active DSRI designed for the intelligent radar/sonar (IRS) domain is introduced to facilitate rapid and customized SoC development. This platform offers flexible and energy-efficient interconnections tailored for IRS, platform infrastructure functions, and peripherals to simplify the chiplets. Furthermore, it integrates lightweight, composable standard 3-D interfaces across the chiplets and interposer, delivering up to 96-Gb/s bandwidth, 11.1-ns latency, and 0.62-pJ/bit energy efficiency, well controlling the cost and power penalties of SoC partition. Demonstrated with a customized hand gesture recognition sonar system (HGRSS) baseband SoC implemented on the proposed platform, it achieves similar performance to a monolithic SoC, with a recognition frame rate of 6286 frames/s, where overhead of the 3-D interface is only 6.86% in area and 4.84% in power. Our approach proves cost-effective, energy efficient, and customizable, moving system volume breakeven point forward by $3.22\sim 3.36$ times, and reducing the cost by 58.5%~59.8%. This represents a pioneering demonstration of reusable chiplets in HGRSS, showcasing the potential of our approach for broader domains.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.