Shan Lu;Danyu Wu;Xuan Guo;Hanbo Jia;Yong Chen;Xinyu Liu
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引用次数: 0
Abstract
This brief reports on a 13-GHz quad-core voltage-controlled oscillator (VCO) using a folded S-shaped tail inductor. The contribution of this work is that the auxiliary resonator is folded into the main inductor, so that it leads to a more compact solution than a conventional scheme. Due to the S-shaped inductor’s electromagnetic (EM) characteristics, the proposed tail filter can achieve noise suppression without EM interference to the main tank. Designed and implemented in a 28-nm CMOS process, the proposed VCO operates between 12.32 and 13.84 GHz, for an 11.6% turning range. The measurements were carried out in the free-running mode, and the results show a phase noise (PN) of 118.3 dBc/Hz at a 1-MHz offset from the central frequency of 12.32 GHz. The power consumption of the VCO core is 24.5 mW, with a 0.9-V supply voltage, and this leads to a figure of merit (FoM) of 186.6 dBc/Hz.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.