Syed Mohsin Abbas;Marwan Jalaleddine;Chi-Ying Tsui;Warren J. Gross
{"title":"Improved Step-GRAND: Low-Latency Soft-Input Guessing Random Additive Noise Decoding","authors":"Syed Mohsin Abbas;Marwan Jalaleddine;Chi-Ying Tsui;Warren J. Gross","doi":"10.1109/TVLSI.2025.3529637","DOIUrl":null,"url":null,"abstract":"The ultrareliable low-latency communication (URLLC) application scenario requires the adoption of short linear block codes to satisfy the low-latency requirements. Guessing random additive noise decoding (GRAND) is a prominent universal decoding solution for short linear block codes that lends itself to efficient hardware implementations. GRAND-based hardware implementations generally offer reduced average decoding latency but their high worst-case (W.C.) latency renders them unsuitable for deployment in mission-critical applications. This article presents an improved version of step-GRAND, a soft-input variant of GRAND that features a novel test error pattern (TEP) generating approach. A novel very large-scale integration (VLSI) architecture is developed for the execution of the improved step-GRAND algorithm with reduced W.C. decoding latency. Application specific integrated circuit (ASIC) implementation results, employing low-power (LP) TSMC 65-nm CMOS technology, demonstrate that the proposed improved step-GRAND can achieve an average decoding latency as low as 10 ns for decoding a <inline-formula> <tex-math>$(128,105)$ </tex-math></inline-formula> linear block code at a target frame error rate (FER) of <inline-formula> <tex-math>$10^{-7}$ </tex-math></inline-formula>, while the W.C. decoding latency can reach <inline-formula> <tex-math>$300~\\text {ns}\\sim 1~\\mu \\text { s}$ </tex-math></inline-formula> depending on the parametric settings. Compared with the previously proposed baseline soft-input ordered reliability bits GRAND (ORBGRAND) hardware implementation with similar decoding performance at target FER of <inline-formula> <tex-math>$10^{-7}$ </tex-math></inline-formula>, the improved step-GRAND hardware achieves <inline-formula> <tex-math>$7 \\times \\sim 17\\times $ </tex-math></inline-formula> reduction in W.C. latency, <inline-formula> <tex-math>$7\\times $ </tex-math></inline-formula> reduction in power consumption, and <inline-formula> <tex-math>$37 \\times \\sim 66\\times $ </tex-math></inline-formula> higher area efficiency in the W.C. scenario. Furthermore, the proposed hardware can achieve an average throughput of up to 10.5 Gb/s and a W.C. throughput of <inline-formula> <tex-math>$102\\sim 350$ </tex-math></inline-formula> Mb/s.","PeriodicalId":13425,"journal":{"name":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","volume":"33 4","pages":"1028-1041"},"PeriodicalIF":2.8000,"publicationDate":"2025-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10851307/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0
Abstract
The ultrareliable low-latency communication (URLLC) application scenario requires the adoption of short linear block codes to satisfy the low-latency requirements. Guessing random additive noise decoding (GRAND) is a prominent universal decoding solution for short linear block codes that lends itself to efficient hardware implementations. GRAND-based hardware implementations generally offer reduced average decoding latency but their high worst-case (W.C.) latency renders them unsuitable for deployment in mission-critical applications. This article presents an improved version of step-GRAND, a soft-input variant of GRAND that features a novel test error pattern (TEP) generating approach. A novel very large-scale integration (VLSI) architecture is developed for the execution of the improved step-GRAND algorithm with reduced W.C. decoding latency. Application specific integrated circuit (ASIC) implementation results, employing low-power (LP) TSMC 65-nm CMOS technology, demonstrate that the proposed improved step-GRAND can achieve an average decoding latency as low as 10 ns for decoding a $(128,105)$ linear block code at a target frame error rate (FER) of $10^{-7}$ , while the W.C. decoding latency can reach $300~\text {ns}\sim 1~\mu \text { s}$ depending on the parametric settings. Compared with the previously proposed baseline soft-input ordered reliability bits GRAND (ORBGRAND) hardware implementation with similar decoding performance at target FER of $10^{-7}$ , the improved step-GRAND hardware achieves $7 \times \sim 17\times $ reduction in W.C. latency, $7\times $ reduction in power consumption, and $37 \times \sim 66\times $ higher area efficiency in the W.C. scenario. Furthermore, the proposed hardware can achieve an average throughput of up to 10.5 Gb/s and a W.C. throughput of $102\sim 350$ Mb/s.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.