Improved Step-GRAND: Low-Latency Soft-Input Guessing Random Additive Noise Decoding

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Syed Mohsin Abbas;Marwan Jalaleddine;Chi-Ying Tsui;Warren J. Gross
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Abstract

The ultrareliable low-latency communication (URLLC) application scenario requires the adoption of short linear block codes to satisfy the low-latency requirements. Guessing random additive noise decoding (GRAND) is a prominent universal decoding solution for short linear block codes that lends itself to efficient hardware implementations. GRAND-based hardware implementations generally offer reduced average decoding latency but their high worst-case (W.C.) latency renders them unsuitable for deployment in mission-critical applications. This article presents an improved version of step-GRAND, a soft-input variant of GRAND that features a novel test error pattern (TEP) generating approach. A novel very large-scale integration (VLSI) architecture is developed for the execution of the improved step-GRAND algorithm with reduced W.C. decoding latency. Application specific integrated circuit (ASIC) implementation results, employing low-power (LP) TSMC 65-nm CMOS technology, demonstrate that the proposed improved step-GRAND can achieve an average decoding latency as low as 10 ns for decoding a $(128,105)$ linear block code at a target frame error rate (FER) of $10^{-7}$ , while the W.C. decoding latency can reach $300~\text {ns}\sim 1~\mu \text { s}$ depending on the parametric settings. Compared with the previously proposed baseline soft-input ordered reliability bits GRAND (ORBGRAND) hardware implementation with similar decoding performance at target FER of $10^{-7}$ , the improved step-GRAND hardware achieves $7 \times \sim 17\times $ reduction in W.C. latency, $7\times $ reduction in power consumption, and $37 \times \sim 66\times $ higher area efficiency in the W.C. scenario. Furthermore, the proposed hardware can achieve an average throughput of up to 10.5 Gb/s and a W.C. throughput of $102\sim 350$ Mb/s.
改进的Step-GRAND:低延迟软输入猜测随机加性噪声解码
超可靠低时延通信(URLLC)应用场景要求采用短线性分组码来满足低时延要求。猜测随机加性噪声解码(GRAND)是短线性分组码的一种突出的通用解码解决方案,它使自己具有高效的硬件实现。基于grand的硬件实现通常提供较低的平均解码延迟,但其较高的最坏情况(W.C.)延迟使得它们不适合部署在关键任务应用程序中。本文介绍了step-GRAND的改进版本,这是GRAND的软输入变体,具有新颖的测试错误模式(TEP)生成方法。提出了一种新型的超大规模集成(VLSI)架构,用于执行改进的step-GRAND算法,降低了W.C.解码延迟。采用低功耗(LP)台积电65纳米CMOS技术的专用集成电路(ASIC)实现结果表明,所提出的改进step-GRAND在目标帧误码率(FER)为$10^{-7}$的情况下,解码$(128,105)$线性分组码的平均解码延迟可低至10 ns,而W.C.解码延迟可达到$300~\text {ns}\sim 1~\mu \text { s}$,具体取决于参数设置。与先前提出的基线软输入有序可靠性位GRAND (ORBGRAND)硬件实现相比,改进的阶跃GRAND硬件实现在目标FER为$10^{-7}$时具有相似的解码性能,在W.C.场景中实现了$7 \times \sim 17\times $降低W.C.延迟,$7\times $降低功耗和$37 \times \sim 66\times $更高的面积效率。此外,提议的硬件可以实现高达10.5 Gb/s的平均吞吐量和$102\sim 350$ Mb/s的W.C.吞吐量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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