Construction and electromagnetic wave absorption properties of polypyrrole encapsulated Ni-MOF nanoflower derivatives

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Kun Zhang, Xuedong Zhang, Yizhuo Sun, Youjian Chen, Fengyi Zhang, Yaxin Wang, Xiaoyu Zhao, Renxian Gao, Rufei Cui, Yongjun Zhang
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引用次数: 0

Abstract

Ultrathin and lightweight electromagnetic wave absorption (EMA) materials have gained tremendous research interest due to their potential application value to reduce electromagnetic radiation pollution. Integrated utilization of heterointerface engineering and in situ polymerization have been identified as effective strategies for preparing composite materials with enhanced EMA properties. In this work, Ni/C composite derived from Ni-MOF-74 was chosen as a supportive to direct the in situ polymerization of polypyrrole (PPy) under the guidance of π–π stacking attraction. Owing to the intrinsic magnetoelectric response properties of Ni/C composites, the tunable electrical conductivity of PPy, and the cooperative merits of well-tuned impedance matching, all the synthesized Ni/C-PPy exhibit favorable electromagnetic attenuation capabilities, and with the highest minimum reflection loss (RLmin) value of −57.5 dB at an ultrathin thickness of 1.75 mm and the largest effective absorption bandwidth (EABmax) of 4.8 GHz at 1.9 mm for Ni/C-PPy-2. The heterointerface engineering strategy applied in this work, which is economical and environmentally friendly by tuning the in situ polymerization process under ambient conditions, is expected to be a promising approach for the development of EMA materials.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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