Effect of a silicon micro addition on the thermal stability of hardening and structure of θ′-phase particles during annealing of 2219 alloy with Sn addition

IF 0.8 4区 材料科学 Q4 METALLURGY & METALLURGICAL ENGINEERING
T. K. Akopyan, N. V. Letyagin, A. S. Fortuna
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Abstract

A comparative analysis of the effect of aging temperature in the interval of 175–250 °C as well as holding time on the stability of the achieved hardening and structural evolution of the aging products (θ-phase particles) is carried out for experimental wrought Al–6Cu–0.5Mn, Al–6Cu–0.5Mn–0.1Sn, and Al–6Cu–0.5Mn–0.1Sn–0.2Si alloys having tin and silicon micro additions in their compositions. Experimental studies into the structure are conducted using the methods of electronic scanning and transmission microscopy, while studies of physical and mechanical properties are conducted by analyzing changes in hardness (HV) and specific electrical conductivity during isothermal aging of alloys obtained in the form of flat products. A micro addition of tin significantly increases the peak hardness of alloys in the entire studied interval of aging temperatures. The increase in temperature of up to 250 °C, compared to aging at a lower temperature of 175 °C, leads to a natural decrease in the peak hardness of the studied alloys, although to varying degrees. The peak hardness of tin-containing alloys decreased only by 10% (up to 140 HV) compared to 18% (up to 110 HV) in the base Al–6Cu–0.5Mn alloy. A gradual decrease in hardness of all alloys at different rates after achieving peak hardening during prolonged holding and aging at 250 °C is shown. At the same time, the rate of decrease in hardness of the Al–6Cu–0.5Mn–0.1Sn–0.2Si alloy with a silicon micro addition during ongoing annealing is significantly lower than that of other two alloys. An analysis of the microstructure showed that the proportion of more dispersed particles is significantly higher in the Al–6Cu–0.5Mn–0.1Sn–0.2Si alloy with a silicon micro addition compared to that in the Al–6Cu–0.5Mn–0.1Sn alloy. This circumstance may explain the observed higher hardness of the alloy with a small silicon addition after long-term high-temperature annealing.

Abstract Image

添加微量硅对添加锡的2219合金退火过程中θ′相颗粒组织和硬化热稳定性的影响
对比分析了175 ~ 250 °C时效温度和保温时间对Al-6Cu-0.5Mn、Al-6Cu-0.5Mn - 0.1 sn和Al-6Cu-0.5Mn - 0.1 sn - 0.2 si合金淬火稳定性和时效产物(θ′相粒子)组织演变的影响。采用电子扫描和透射显微镜的方法对其组织进行了实验研究,通过分析合金在等温时效过程中硬度(HV)和比电导率的变化进行了物理力学性能的研究。微量添加锡显著提高了合金在整个时效温度区间内的峰值硬度。与在175 ℃的较低温度下时效相比,将温度提高到250 ℃会导致所研究合金的峰值硬度自然下降,尽管程度不同。含锡合金的峰值硬度仅下降10%(高达140 HV),而Al-6Cu-0.5Mn基合金的峰值硬度下降18%(高达110 HV)。结果表明,在250 ℃长时间保温时效达到峰值硬化后,所有合金的硬度都以不同的速率逐渐下降。同时,在退火过程中添加微量硅的Al-6Cu-0.5Mn-0.1Sn-0.2Si合金的硬度下降速率明显低于其他两种合金。显微组织分析表明,与Al-6Cu-0.5Mn-0.1Sn - 0.2 si合金相比,添加微量硅的Al-6Cu-0.5Mn-0.1Sn合金中弥散颗粒的比例显著提高。这种情况可以解释长期高温退火后添加少量硅的合金硬度较高的原因。
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来源期刊
Metallurgist
Metallurgist 工程技术-冶金工程
CiteScore
1.50
自引率
44.40%
发文量
151
审稿时长
4-8 weeks
期刊介绍: Metallurgist is the leading Russian journal in metallurgy. Publication started in 1956. Basic topics covered include: State of the art and development of enterprises in ferrous and nonferrous metallurgy and mining; Metallurgy of ferrous, nonferrous, rare, and precious metals; Metallurgical equipment; Automation and control; Protection of labor; Protection of the environment; Resources and energy saving; Quality and certification; History of metallurgy; Inventions (patents).
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