Bin Gu, Jérôme Adrien, Eric Maire, Ning Dang, Werner Skrotzki
{"title":"Damage mechanisms of a metastable β-titanium alloy with bimodal microstructure revealed by void growth models using synchrotron X-ray microtomography","authors":"Bin Gu, Jérôme Adrien, Eric Maire, Ning Dang, Werner Skrotzki","doi":"10.1007/s12598-024-03029-5","DOIUrl":null,"url":null,"abstract":"<div><p>In order to investigate the damage tolerance of a metastable Ti-5Al-3V-3Mo-2Cr-2Zr-1Nb-1Fe (Ti5321) alloy with bimodal microstructure using void growth quantification and micromechanical modeling, in situ tensile testing was performed during X-ray microtomography experiments. Compared with investigations of surface voids by traditional two-dimensional (2D) methods involving post-mortem characterization, three-dimensional (3D) information on void evolution inside optically opaque samples obtained through X-ray microtomography is essential. The Rice and Tracey model and Huang model were applied to predict void growth and show good agreement with experimental data using calibration of the damage parameter <i>α</i>. The void growth kinetics of Ti5321 with bimodal microstructure was analyzed by comparing the <i>α</i> value with that of Ti64 for different microstructure morphologies. The damage mechanism of ductile fracture of Ti5321 with bimodal microstructure is discussed. It was found that the size of the voids apparently increases with the triaxiality of stress. Post-mortem scanning electron microscopy (SEM) was also used to demonstrate this damage mechanism of ductile fracture of Ti5321.</p><h3>Graphical abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":749,"journal":{"name":"Rare Metals","volume":"44 3","pages":"1972 - 1981"},"PeriodicalIF":9.6000,"publicationDate":"2024-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Rare Metals","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12598-024-03029-5","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
In order to investigate the damage tolerance of a metastable Ti-5Al-3V-3Mo-2Cr-2Zr-1Nb-1Fe (Ti5321) alloy with bimodal microstructure using void growth quantification and micromechanical modeling, in situ tensile testing was performed during X-ray microtomography experiments. Compared with investigations of surface voids by traditional two-dimensional (2D) methods involving post-mortem characterization, three-dimensional (3D) information on void evolution inside optically opaque samples obtained through X-ray microtomography is essential. The Rice and Tracey model and Huang model were applied to predict void growth and show good agreement with experimental data using calibration of the damage parameter α. The void growth kinetics of Ti5321 with bimodal microstructure was analyzed by comparing the α value with that of Ti64 for different microstructure morphologies. The damage mechanism of ductile fracture of Ti5321 with bimodal microstructure is discussed. It was found that the size of the voids apparently increases with the triaxiality of stress. Post-mortem scanning electron microscopy (SEM) was also used to demonstrate this damage mechanism of ductile fracture of Ti5321.
期刊介绍:
Rare Metals is a monthly peer-reviewed journal published by the Nonferrous Metals Society of China. It serves as a platform for engineers and scientists to communicate and disseminate original research articles in the field of rare metals. The journal focuses on a wide range of topics including metallurgy, processing, and determination of rare metals. Additionally, it showcases the application of rare metals in advanced materials such as superconductors, semiconductors, composites, and ceramics.