Fill factor enhancement with graded interface hole-selective contact for silicon heterojunction solar cells: impact of recombination losses and contact resistivity
IF 2.8 4区 工程技术Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shrestha Bhattacharya, Shahnawaz Alam, Ashutosh Pandey, Silajit Manna, Son Pal Singh, Vamsi Krishna Komarala
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引用次数: 0
Abstract
The development of high-efficiency silicon heterojunction (SHJ) solar cells is primarily dependent on optimizing interface recombination losses (J0) and series resistance components (Rs), which critically influence the cell's fill factor (FF). The hole-selective p-a-Si:H/ITO contact is optimized by coupling the graded boron-doped a-Si:H and indium tin oxide (ITO) layers’ electronic properties for low J0 and contact resistance (ρc). The graded p-a-Si:H layer enabled a low defective interface at the n-type c-Si wafer, which has been investigated through J0 at various stages of device fabrication. The carrier transport modification was analyzed by evaluating the J–V characteristics of the cell obtained under light, dark, and Suns-Voc conditions. The diode quality factor (n1 ~ 0.89 < 1), derived from the linear portion of the Suns-Voc characteristics of an optimized cell, indicates that within the voltage range of 0.60 to 0.75 V (near open-circuit voltage), the characteristics are somewhat affected by Auger recombination processes. This effect aids in achieving a higher fill factor (FF) than what is typically constrained by Shockley–Read–Hall recombination. With the optimized p-a-Si:H/ITO contact compared to the baseline cell process, the pseudo-FF enhanced from ~ 81.2% to ~ 85.1% (represents recombination and shunt losses), and the FF enhanced from ~ 75.1% to ~ 81.8% (due to reduced ρc of i + p/ITO from ~ 756 mΩ-cm2 to ~ 406 mΩ-cm2), over all the cell efficiency has enhanced from ~ 21.0 to ~ 23.3%.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.